MPXV6115VC6T1

MPXV6115V
Sensors
Freescale Semiconductor, Inc. 7
4 Package Information
4.1 Minimum recommended footprint for surface mounted applications
Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the
correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the
packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask
layer to avoid bridging and shorting between solder pads.
Figure 9. SOP footprint (case 98ASB17756C)
0.660
16.76
0.060 TYP 8X
1.52
0.100 TYP 8X
2.54
0.100 TYP 6X
2.54
0.300
7.62
inch
mm
SCALE 2:1
MPXV6115V
Sensors
8 Freescale Semiconductor, Inc.
4.2 Package Dimensions
This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASB17756C.pdf.
Case 98ASB17756C, small outline package, surface mount
MPXV6115V
Sensors
Freescale Semiconductor, Inc. 9
This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASB17757C.pdf.
Case 98ASB17757C, small outline package, through-hole

MPXV6115VC6T1

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
PRESSURE SENSOR AXIAL PORT 8-SOP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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