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Document Number: 84606
6 Rev. 1.3, 13-May-09
TCND3000
Vishay Semiconductors
Reflective Sensor for Touchless
Switch
REFLOW SOLDER PROFILES
Fig. 7 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020
Fig. 8 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
FLOOR LIFE
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
Floor life: 4 weeks
Conditions: T
amb
< 30 °C, RH < 60 %
Moisture sensitivity level 2a, acc. to J-STD-020.
DRYING
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
20
Temperature (°C)
20 s
~
30 s
~
40 s120 s
~
125 °C
145 °C
210 °C
250 °C
260 °C
280
260
240
220
200
180
160
140
80
60
40
100
120
0
0
Time (s)
Preheat Reflow Cooling
19030
300270
240
210
180150
12090
60
30
max. 160 °C
Full Line: Typical
Dotted: Process Limits
Time
s
Temperature (°C)
Lead Temperature
90 s to 120 s
300
250
200
150
100
50
0
0
max. 240 °C ca. 230 °C
10 s
215 °C
max 40 s
2 K/s to 4 K/s
5
250200
150
100 50
