PS9634, PS9634L
Time (s)
Package Surface Temperature T (˚C)
120 to 160 ˚C
60 to 90 s
(preheating)
(heating)
to 10 s
to 30 s
235 ˚C (peak temperature)
210 ˚C
Peak temperature 235˚ C or below
RECOMMENDED SOLDERING CONDITIONS
(1) Infrared reflow soldering
• Peak reflow temperature 235 °C or below (plastic surface)
• Time of temperature higher than 210 °C 30 seconds or less
• Number of reflows Three
• Flux Rosin flux containing a small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt % is recommended.)
(2) Dip soldering
• Temperature 260 °C or below (molten solder temperature)
• Time 10 seconds or less
• Number of times One
• Flux Rosin flux containing a small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt % is recommended.)
CAUTION: Avoid removing the residual flux with water after the first reflow process.
Recommended Temperature Profile of Infrared Reflow
EXCLUSIVE NORTH AMERICAN AGENT FOR RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS
CALIFORNIA EASTERN LABORATORIES • Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054-1817 • (408) 988-3500 • Telex 34-6393 • FAX (408) 988-0279
24-Hour Fax-On-Demand: 800-390-3232 (U.S. and Canada only) • Internet: http://WWW.CEL.COM
12/04/2001
DATA SUBJECT TO CHANGE WITHOUT NOTICE
