OMO ElectronicOMO Electronic
Expand menu
Hello, Sign inMy Account
0 Cart

2286B

P1-P3
6
---Useful Links---
Search by part #
Check distributor
part inventory
Browse Heat sinks
6
- By Device -
6
- By Product Line -
6
-
A
ttachment Method
s
6
- Interface Materials
-
6
-
A
ccessories -
Useful Links
•
Building a part #
•
Catalog Request
•
Directions
•
Find Distributor
•
Find Sales Associate
•
How to order?
•
MSDS Safety Sheets
•
Part # Cross Ref
•
Quote Request
•
RoHS Initiative
•
Sample Request
Products / BGA / Radial Fins
Radial Fin Heat Sinks for Microprocessors
z Bond-on heat sinks for leadless chip carriers and flat packs.
z Primarily designed for 68-position devices.
z The 2283 is ideally suited to limited board space applications with high air flow.
Part Number: 2283BG
Part Number: 2286BG<
Pa
g
e 1 of 3Heat Sinks b
y
Product - radial fin
4/19/2010
Part Number: 2288BG
Part Number: 2292BG
Part Number: 2296BG
Pa
g
e 2 of 3Heat Sinks b
y
Product - radial fin
4/19/2010htt
p
://www.aavidthermallo
y
.com/
p
roducts/b
g
a/radial.shtml
Pa
g
e 3 of 3Heat Sinks b
y
Product - radial fin
4/19/2010htt
p
://www.aavidthermallo
y
.com/
p
roducts/b
g
a/radial.shtml
P1-P3

2286B

Mfr. #:
Buy 2286B
Manufacturer:
Aavid, Thermal Division of Boyd Corporation
Description:
Heat Sinks
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet