NXP Semiconductors
1PS79SB10
Schottky barrier single diode
1PS79SB10 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved
Product data sheet 14 August 2012 5 / 8
10. Soldering
Footprint information for reflow soldering of plastic surface-mounted, 2 leads package SOD523
sod523_fr
occupied area
solder land
solder resist
solder land plus solder paste
solder paste deposit
Dimensions in mm
0.6
(2×)
0.5
(2×)
2.15
1.4
0.4
(2×)
0.5
(2×)
1.2
Fig. 5. Reflow soldering footprint for SOD523 (SOD523)
11. Revision history
Table 8. Revision history
Data sheet ID Release date Data sheet status Change notice Supersedes
1PS79SB10 v.2 20120814 Product data sheet - 1PS79SB10 v.1
Modifications:
•
The format of this document has been redesigned to comply with the new identity guidelines
of NXP Semiconductors.
•
Legal texts have been adapted to the new company name where appropriate.
•
Package outline drawing replaced by minimized package outline drawing.
•
Section "Test information" added.
•
Section "Soldering" added.
1PS79SB10 v.1 19980716 Product data sheet - -