NCP432, NCP433
http://onsemi.com
3
MAXIMUM RATINGS
Rating Symbol Value Unit
IN, OUT, EN, Pins: V
EN,
V
IN,
V
OUT
−0.3 to + 4.0 V
From IN to OUT Pins: Input/Output V
IN,
V
OUT
0 to + 4.0 V
Maximum Junction Temperature T
J
−40 to + 125 °C
Storage Temperature Range T
STG
−40 to + 150 °C
Human Body Model (HBM) ESD Rating are (Notes 1 and 2) ESD HBM 7000 V
Machine Model (MM) ESD Rating are (Notes 1 and 2) ESD MM 250 V
Charge Device Model (CDM) ESD Rating are (Notes 1 and 2) ESD CDM 2000 V
Latch−up protection (Note 3)
− Pins IN, OUT, EN
LU
100
mA
Moisture Sensitivity (Note 4) MSL Level 1
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. According to JEDEC standard JESD22−A108.
2. This device series contains ESD protection and passes the following tests:
Human Body Model (HBM) ±7.0 kV per JEDEC standard: JESD22−A114 for all pins.
Machine Model (MM) ±250 V per JEDEC standard: JESD22−A115 for all pins.
Charge Device Model (CDM) ±2.0 kV per JEDEC standard: JESD22−C101 for all pins.
3. Latch up Current Maximum Rating: ±100 mA per JEDEC standard: JESD78 class II.
4. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020.
OPERATING CONDITIONS
Symbol Parameter Conditions Min Typ Max Unit
V
IN
Operational Power Supply 1.0 3.6 V
V
EN
Enable Voltage 0 3.6
T
A
Ambient Temperature Range −40 25 +85 °C
C
IN
Decoupling input capacitor 1
mF
C
OUT
Decoupling output capacitor 1
mF
R
q
JA
Thermal Resistance Junction to Air WLCSP package (Note 5) 150 °C/W
I
OUT
Maximum DC current 1.5 A
P
D
Power Dissipation Rating (Note 6)
T
A
≤ 25°C WLCSP package 0.5 W
T
A
= 85°C WLCSP package 0.2 W
5. The R
q
JA
is dependent of the PCB heat dissipation and thermal via.
6. The maximum power dissipation (P
D
) is given by the following formula:
