WeEn Semiconductors
BT134W-600
4Q Triac
BT134W-600 All information provided in this document is subject to legal disclaimers.
©
WeEn Semiconductors Co., Ltd. 2016. All rights reserved
Product data sheet 14 June 2016 6 / 16
9. Thermal characteristics
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-sp)
thermal resistance
from junction to solder
point
full cycle; Fig. 6 - - 15 K/W
full cycle; printed circuit board mounted;
minimum footprint; Fig. 7
- 156 - K/WR
th(j-a)
thermal resistance
from junction to
ambient free air
full cycle; printed circuit board mounted;
pad area; Fig. 8
- 70 - K/W
003aae965
1
10
-1
10
10
2
Z
th(j-sp)
(K/W)
10
-2
t
p
(s)
10
-5
1 1010
-1
10
-2
10
-4
10
-3
t
p
P
t
bidirectional
unidirectional
Fig. 6. Transient thermal impedance from junction to solder point as a function of pulse width