All statements, technical information and recommendations herein are based on tests we believe to be reliable, and
THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED
WARRANTIES OF MARKETABILITY AND FITNESS FOR PURPOSE. Sellers’ and manufacturers’ only obligation shall be to
replace such quantity of the product proved to be defective. Before using, user shall determine the suitability of the product
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MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE, DIRECT,
INCIDENTAL, OR CONSEQUENTIAL, INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE OR
THE INABILITY TO USE A PRODUCT. No statement, purchase order or recommendations by seller or purchaser not
contained herein shall have any force or effect unless in an agreement signed by the officers of the seller and manufacturer.
PDS_GP_1500_0711
Gap Pad
®
1500
Thermally Conductive, Un-Reinforced Gap Filling Material
www.bergquistcompany.com
The Bergquist Company -
North American Headquarters
18930 West 78th Street
Chanhassen, MN 55317
Phone: 800-347-4572
Fax: 952-835-0430
The Bergquist Company -
European Headquarters
Netherlands
Phone: 31-35-5380684
Fax: 31-35-5380295
The Bergquist Company -
Asia Headquarters
Hong Kong
Phone: 852-2690-9296
Fax: 852-2690-2344
Features and Benefits
• Thermal conductivity: 1.5 W/m-K
• Un-reinforced construction for additional
compliancy
• Conformable, low hardness
• Electrically isolating
Gap Pad 1500 has an ideal filler blend that
gives it a low-modulus characteristic that
maintains optimal thermal performance yet
still allows for easy handling.The natural tack
on both sides of the material allows for
good compliance to adjacent surfaces of
components, minimizing interfacial resistance.
Note: Resultant thickness is defined as the final gap
thickness of the application.
0 1 3 2 5 4 6
200
150
100
50
0
Thickness vs. Thermal Resistance
Gap Pad 1500
Thermal Resistance (C-in
2
/W)
Resultant Thickness (mils)
Typical Applications Include:
• Telecommunications
• Computer and peripherals
• Power conversion
• RDRAM™ memory modules / chip scale packages
• Areas where heat needs to be transferred to a frame chassis or other type of heat spreader
Configurations Available:
• Sheet form and die-cut parts
Building a Part Number Standard Options
Section A
Section B
Section C
Section D
Section E
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
GP1500 = Gap Pad 1500 Material
GP1500 0.100 02 0816 NA
Note: To build a part number, visit our website at www.bergquistcompany.com.
Standard thicknesses available: 0.020", 0.040", 0.060",
0.080", 0.100", 0.125", 0.160", 0.200"
02 = Natural tack, both sides
0816 = Standard sheet size 8" x 16", or
00 = custom configuration
––––
TYPICAL PROPERTIES OF GAP PAD 1500
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Black Black Visual
Reinforcement Carrier — — —
Thickness (inch) / (mm) 0.020 to 0.200 0.508 to 5.080 ASTM D374
Inherent Surface Tack (1 sided) 2 2 —
Density (Bulk Rubber) (g/cc) 2.1 2.1 ASTM D792
Heat Capacity (J/g-K) 1.0 1.0 ASTM E1269
Hardness (Bulk Rubber) (Shore 00) (1) 40 40 ASTM D2240
Young's Modulus (psi) / (kPa) (2) 45 310 ASTM D575
Continuous Use Temp (°F) / (°C) -76 to 392 -60 to 200 —
ELECTRICAL
Dielectric Breakdown Voltage (Vac) >6000 >6000 ASTM D149
Dielectric Constant (1000 Hz) 5.5 5.5 ASTM D150
Volume Resistivity (Ohm-meter) 10
11
10
11
ASTM D257
Flame Rating V-O V-O U.L. 94
THERMAL
Thermal Conductivity (W/m-K) 1.5 1.5 ASTM D5470
THERMAL PERFORMANCE vs. STRAIN
Deflection (% strain) 10 20 30
Thermal Impedance (°C-in
2
/W) 0.040" (3) 1.62 1.50 1.33
1) Thirty second delay value Shore 00 hardness scale. 2)Young’s Modulus, calculated using 0.01 in/min. step rate of strain
with a sample size of 0.79 inch
2
. 3) The ASTM D5470 test fixture was used.The recorded value includes interfacial ther-
mal resistance. These values are provided for reference only. Actual application performance is directly related to the sur-
face roughness, flatness and pressure applied.
