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MCP130T-300I/TT

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16
2001 Microchip Technology Inc. DS11184D-page 7
MCP120/130
3.2 Package Detail Information
3-Lead Plastic Transistor Outline (TO) (TO-92)
432432
β
Mold Draft Angle Bottom
654654
α
0.560.480.41.022.019.016BLead Width
0.510.430.36.020.017.014
c
Lead Thickness
2.412.292.16.095.090.085RMolded Package Radius
4.954.644.32.195.183.170DOverall Length
4.954.714.45.195.186.175E1Overall Width
3.943.623.30.155.143.130ABottom to Package Flat
1.27.050
p
Pitch
33
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERSINCHES*Units
R
n
1
3
α
p
L
B
A
c
β
1
D
2
E1
Tip to Seating Plane L .500 .555 .610 12.70 14.10 15.49
*Controlling Parameter
Mold Draft Angle Top
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: TO-92
Drawing No. C04-101
MCP120/130
DS11184D-page 8 2001 Microchip Technology Inc.
3-Lead Plastic Small Outline Transistor (TT) (SOT23)
10501050
β
Mold Draft Angle Bottom
10501050
α
Mold Draft Angle Top
0.510.440.37.020.017.015BLead Width
0.180.140.09.007.006.004
c
Lead Thickness
10501050
φ
Foot Angle
0.550.450.35.022.018.014LFoot Length
3.042.922.80.120.115.110DOverall Length
1.401.301.20.055.051.047
E1
Molded Package Width
2.642.372.10.104.093.083EOverall Width
0.100.060.01.004.002.000A1Standoff §
1.020.950.88.040.037.035A2Molded Package Thickness
1.121.010.89.044.040.035AOverall Height
1.92.076
p1
Outside lead pitch (basic)
0.96.038
p
Pitch
33
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERSINCHES*Units
2
1
p
D
B
n
E
E1
L
c
β
φ
α
A2
A
A1
p1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: TO-236
Drawing No. C04-104
§ Significant Characteristic
2001 Microchip Technology Inc. DS11184D-page 9
MCP120/130
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC
Foot Angle
φ
048048
1512015120
β
Mold Draft Angle Bottom
1512015120
α
Mold Draft Angle Top
0.510.420.33.020.017.013BLead Width
0.250.230.20.010.009.008
c
Lead Thickness
0.760.620.48.030.025.019LFoot Length
0.510.380.25.020.015.010hChamfer Distance
5.004.904.80.197.193.189DOverall Length
3.993.913.71.157.154.146E1Molded Package Width
6.206.025.79.244.237.228EOverall Width
0.250.180.10.010.007.004
A1
Standoff §
1.551.421.32.061.056.052A2Molded Package Thickness
1.751.551.35.069.061.053AOverall Height
1.27.050
p
Pitch
88
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERSINCHES*Units
2
1
D
n
p
B
E
E1
h
L
β
c
45°
φ
A2
α
A
A1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
§ Significant Characteristic
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16

MCP130T-300I/TT

Mfr. #:
Buy MCP130T-300I/TT
Manufacturer:
Microchip Technology
Description:
Supervisory Circuits w/5K Pull-Up Low
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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