IXTH32P20T

© 2010 IXYS CORPORATION, All Rights Reserved
Symbol Test Conditions Maximum Ratings
V
DSS
T
J
= 25°C to 150°C - 200 V
V
DGR
T
J
= 25°C to 150°C, R
GS
= 1MΩ - 200 V
V
GSS
Continuous + 15 V
V
GSM
Transient + 25 V
I
D25
T
C
= 25°C - 32 A
I
DM
T
C
= 25°C, Pulse Width Limited by T
JM
- 96 A
I
A
T
C
= 25°C - 32 A
E
AS
T
C
= 25°C1J
P
D
T
C
= 25°C 300 W
T
J
-55 ... +150 °C
T
JM
150 °C
T
stg
-55 ... +150 °C
T
L
1.6mm (0.062 in.) from Case for 10s 300 °C
T
SOLD
Plastic body for 10s 260 °C
F
C
Mounting Force (TO-263) 10..65 / 2.2..14.6 N/lb.
M
d
Mounting Torque (TO-220, TO-247 & TO-3P) 1.13 / 10 Nm/lb.in.
Weight TO-263 2.5 g
TO-220 3.0 g
TO-3P 5.5 g
TO-247 6.0 g
DS100288A(11/10)
TrenchP
TM
Power MOSFET
P-Channel Enhancement Mode
Avalanche Rated
IXTA32P20T
IXTP32P20T
IXTQ32P20T
IXTH32P20T
V
DSS
= - 200V
I
D25
= - 32A
R
DS(on)
130m
ΩΩ
ΩΩ
Ω
Features
z
International Standard Packages
z
Avalanche Rated
z
Extended FBSOA
z
Fast Intrinsic Diode
z
Low R
DS(ON)
and Q
G
Advantages
z
Easy to Mount
z
Space Savings
z
High Power Density
Applications
z
High-Side Switching
z
Push Pull Amplifiers
z
DC Choppers
z
Automatic Test Equipment
z
Current Regulators
z
Battery Charger Applications
Preliminary Technical Information
G = Gate D = Drain
S = Source Tab = Drain
TO-247 (IXTH)
G
S
D
D (Tab)
Symbol Test Conditions Characteristic Values
(T
J
= 25°C, Unless Otherwise Specified) Min. Typ. Max.
BV
DSS
V
GS
= 0V, I
D
= - 250μA - 200 V
V
GS(th)
V
DS
= V
GS
, I
D
= - 250μA - 2.0 - 4.0 V
I
GSS
V
GS
= ± 15V, V
DS
= 0V ±100 nA
I
DSS
V
DS
= V
DSS
, V
GS
= 0V - 25 μA
T
J
= 125°C -1.25 mA
R
DS(on)
V
GS
= -10V, I
D
= 0.5 • I
D25
, Note 1 130 mΩ
TO-263 AA (IXTA)
G
S
D (Tab)
G
D
S
TO-220AB (IXTP)
D (Tab)
TO-3P (IXTQ)
D
G
S
D (Tab)
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXTA32P20T IXTQ32P20T
IXTP32P20T IXTH32P20T
IXYS MOSFETs and IGBTs are covered 4,835,592 4,931,844 5,049,961 5,237,481 6,162,665 6,404,065 B1 6,683,344 6,727,585 7,005,734 B2 7,157,338B2
by one or more of the following U.S. patents: 4,850,072 5,017,508 5,063,307 5,381,025 6,259,123 B1 6,534,343 6,710,405 B2 6,759,692 7,063,975 B2
4,881,106 5,034,796 5,187,117 5,486,715 6,306,728 B1 6,583,505 6,710,463 6,771,478 B2 7,071,537
Note 1: Pulse test, t 300μs, duty cycle, d 2%.
Symbol Test Conditions Characteristic Values
(T
J
= 25°C, Unless Otherwise Specified) Min. Typ. Max.
g
fs
V
DS
= -10V, I
D
= 0.5 • I
D25
, Note 1 18 30 S
C
iss
14.5 nF
C
oss
V
GS
= 0V, V
DS
= - 25V, f = 1MHz 565 pF
C
rss
105 pF
t
d(on)
32 ns
t
r
15 ns
t
d(off)
57 ns
t
f
12 ns
Q
g(on)
185 nC
Q
gs
V
GS
= -10V, V
DS
= 0.5 • V
DSS
, I
D
= 0.5 • I
D25
66 nC
Q
gd
45 nC
R
thJC
0.42 °C/W
R
thCS
TO-220 0.50 °C/W
TO-247 &TO-3P 0.21 °C/W
Source-Drain Diode
Symbol Test Conditions Characteristic Values
(T
J
= 25°C, Unless Otherwise Specified) Min. Typ. Max.
I
S
V
GS
= 0V - 32 A
I
SM
Repetitive, Pulse Width Limited by T
JM
- 128 A
V
SD
I
F
= - 32A, V
GS
= 0V, Note 1 -1.3 V
t
rr
190 ns
Q
RM
1.7 μC
I
RM
-17.8 A
Resistive Switching Times
V
GS
= -10V, V
DS
= 0.5 • V
DSS
, I
D
= 0.5 • I
D25
R
G
= 1Ω (External)
I
F
= -16A, -di/dt = -100A/μs
V
R
= -100V, V
GS
= 0V
PRELIMINARY TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications offered are derived
from data gathered during objective characterizations of preliminary engineering lots; but also may yet
contain some information supplied during a pre-production design evaluation. IXYS reserves the right
to change limits, test conditions, and dimensions without notice.
© 2010 IXYS CORPORATION, All Rights Reserved
IXTA32P20T IXTQ32P20T
IXTP32P20T IXTH32P20T
TO-247 Outline
1 = Gate
2 = Drain
3 = Source
TO-3P Outline
Pins: 1 - Gate 2,4 - Drain
3 - Source
Pins: 1 - Gate 2 - Drain
3 - Source
TO-220 Outline
TO-263 Outline

IXTH32P20T

Mfr. #:
Manufacturer:
Littelfuse
Description:
MOSFET TrenchP Power MOSFET
Lifecycle:
New from this manufacturer.
Delivery:
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