UG-1039 EVAL-ADG798EB1Z User Guide
Rev. 0 | Page 4 of 9
EVALUATION BOARD HARDWARE
Evaluate the operation of the ADG798 using the EVAL-
ADG798EB1Z. Figure 1 shows a typical evaluation setup where
only a power supply and signal generator are required. Figure 2
shows the block diagram of the main components of the
evaluation board.
Using the EVAL-ADG798EB1Z evaluation board, the ADG798
passes signals from either the source or drain connectors.
POWER SUPPLY
Connector J10 provides access to the supply pins of the ADG798.
VDD, GND, and VSS on J10 link to the appropriate pins on the
ADG798. For dual-supply voltages, the evaluation board can be
powered by ±2.5 V. For single-supply voltages, the GND and VSS
terminals must be connected together, and the evaluation board
must be powered with a 3.3 V to 5.5 V voltage range. Use the
J10 header to supply the voltage that controls the digital logic
voltage level (VL).
INPUT SIGNALS
Headers connect to both the source pins and the drain pins of
the ADG798. Additional subminiature Version B (SMB) connector
pads are available if extra connections are required.
Each trace on the source and drain side includes two sets of
0805 pads, which can be used to place a load on the signal path
to ground. A 0 Ω resistor is placed in the signal path and can be
replaced with a user defined value. The resistor, combined with
the 0805 pads, creates a simple resistor-capacitor (RC) filter.
The ADG798 uses a parallel interface to control the operation of
the switches. The switch operation can be manually controlled
using the LK1 to LK4 switches, or an external controller can be
interfaced directly to the control pins by using the SMB connector
pads, if required (EN, A0, A1, and A2). See Table 1 for the logic
control truth table.
BOARD CONSTRUCTION
The entire board assembly uses high temperature rated
components, including passives, connectors, printed circuit
board (PCB) material, and solder material. A polyimide PCB
laminate is used due to its very high glass transition temperature
(T
G
), which allows the board to maintain integrity at high
temperature when standard laminate typically deteriorates.
Sn90Sb10, Pb-free solder is used due to its high melting point
(245°C to 250°C). NiAu surface finish (plating) is used on the
PCB to avoid intermetallic formation between the tin in the
solder with copper PCB traces at high temperatures. The
resistors, capacitors, and connectors used are rated for extended
temperature by their respective manufacturers. For more details
on the board construction, see the bill of materials in Table 3.