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AT49BV802A-70TU

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P31
28
3405E–FLASH–2/07
AT49BV802A(T)
33. Packaging Information
33.1 48C19 – CBGA
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
48C19, 48-ball (6 x 8 Array), 0.80 mm Pitch,
6.0 x 8.0 x 1.0 mm Chip-scale Ball Grid Array Package (CBGA)
A
48C19
7/2/03
Top View
Bottom View
Side View
A
B
C
D
E
F
G
H
1.0 REF
1.20 REF
E
D
A1 Ball ID
6 54321
E1
D1
A
A1
e
e
A1 Ball Corner
Øb
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
E 5.90 6.00 6.10
E1 4.0 TYP
D 7.90 8.00 8.10
D1 5.6 TYP
A – – 1.0
A1 0.22 – –
e 0.80 BSC
Øb 0.40 TYP
29
3405E–FLASH–2/07
AT49BV802A(T)
33.2 48T – TSOP
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
48T, 48-lead (12 x 20 mm Package) Plastic Thin Small Outline
Package, Type I (TSOP)
B
48T
10/18/01
PIN 1
0º ~ 8º
D1
D
Pin 1 Identifier
b
e
E
A
A2
c
L
GAGE PLANE
SEATING PLANE
L1
A1
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
Notes: 1. This package conforms to JEDEC reference MO-142, Variation DD.
2. Dimensions D1 and E do not include mold protrusion. Allowable
protrusion on E is 0.15 mm per side and on D1 is 0.25 mm per side.
3. Lead coplanarity is 0.10 mm maximum.
A – – 1.20
A1 0.05 – 0.15
A2 0.95 1.00 1.05
D 19.80 20.00 20.20
D1 18.30 18.40 18.50 Note 2
E 11.90 12.00 12.10 Note 2
L 0.50 0.60 0.70
L1 0.25 BASIC
b 0.17 0.22 0.27
c 0.10 – 0.21
e 0.50 BASIC
30
3405E–FLASH–2/07
AT49BV802A(T)
34. Revision History
Revision A – February 2004 • Initial Release
Revision B – March 2004
• Removed AT49BV808A(T) device from datasheet
• Modified CBGA Pinout and Package Drawing for
AT49BV802A(T)
Revision C – September 2004 • Removed Preliminary from the datasheet
Revision D – March 2005
• Converted datasheet to New Template.
• Added TSOP Green Package (Pb/Halide-free).
Revision E – Feb. 2007
• Moved to Mature Products -- Not recommended for
New Designs.
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P31

AT49BV802A-70TU

Mfr. #:
Buy AT49BV802A-70TU
Manufacturer:
Microchip Technology / Atmel
Description:
NOR Flash 8M TOP BOOT-PKG- 8M BTTM BOOT
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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