MAX9875
Low RF Susceptibility, Mono Audio
Subsystem with DirectDrive Headphone Amplifier
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WLP Applications Information
For the latest application details on WLP construction,
dimensions, tape carrier information, PCB techniques,
bump-pad layout, and recommended reflow tempera-
ture profile, as well as the latest information on reliability
testing results, refer to the
Application Note: UCSP—A
Wafer-Level Chip-Scale Package
on Maxim’s website
at www.maxim-ic.com/ucsp. See Figure 15 for the
recommended PCB footprint for the MAX9875.