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EMIF02-USB03F2

P1-P3P4-P6P7-P8
Application information EMIF02-USB03F2
4/8 DocID10740 Rev 6
2 Application information
Figure 9. Application schematic
Figure 10. Aplac model
Figure 11. Aplac parameters
R1 = R2 = 33 Ω
Cline = 20 pF max.
D+
D-
Vbus
ID
D+
D+OUT D+IN
D-IN
D-OUT
Pd2
Pd1
D-
Vbus
ID
GND GND
USB OTG connector
R2=33Ω
R3=1.3kΩ
Pup Dz ID Vbus
R1=33Ω
3.3V
USB OTG Xceiver
EMIF02-USB03F2
R5=15kΩ R4=17kΩ
bulk
MODEL = D02_usb03
R_33R
bulkbulk
Port1
C2
50
R_1k3
C3
MODEL = D02_usb03
A3
Port2
bulk
50
bulk
A2
MODEL = D02_usb03
B2
R_33R
R_15k
D3
C2
bulk
Lbump
C1
R_17k
B1
bulk
bulk
MODEL = D02_usb03_gnd
C3
D2
C1
bulk
bulk
Rbump
D1
D1
bulkD3
bulk
bulkB1
bulkB3
LbumpRbump
D2
Lbump
Rbump
Lgnd
Rgnd
B3
bulk
Cgnd
B1
bulk
B2
RsLs Rs Ls
bulk
RsubumpCbump
A3
bulkB2
bulkA2
bulkC3
bulkC2
C1
RsubumpCbump
RsubumpCbump
RsubumpCbump
RsubumpCbump
RsubumpCbump
RsubumpCbump
RsubumpCbump
RsubumpCbump
RsubumpCbump
bulk
MODEL = D02_usb03
R_33R
bulkbulk
Port1
C2
50
R_1k3
C3
MODEL = D02_usb03
A3
Port2
bulk
50
bulk
A2
MODEL = D02_usb03
B2
R_33R
R_15k
D3
C2
bulk
Lbump
C1
R_17k
B1
bulk
bulk
MODEL = D02_usb03_gnd
C3
D2
C1
bulk
bulk
Rbump
D1
D1
bulkD3
bulk
bulkB1
bulkB3
LbumpRbump
D2
Lbump
Rbump
Lgnd
Rgnd
D2
Lbump
Rbump
Lgnd
Rgnd
B3
bulk
Cgnd
B1
bulk
B2
RsLs Rs Ls
bulk
RsubumpCbump RsubumpCbump
A3
bulkB2
bulkA2
bulkC3
bulkC2
C1
RsubumpCbump RsubumpCbump
RsubumpCbump RsubumpCbump
RsubumpCbump RsubumpCbump
RsubumpCbump RsubumpCbump
RsubumpCbump RsubumpCbump
RsubumpCbump RsubumpCbump
RsubumpCbump RsubumpCbump
RsubumpCbump RsubumpCbump
RsubumpCbump RsubumpCbump
Ls 950pH
Rs 150m
R_33R 33
R_1k3 1.3k
R_15k 15k
R_17k 17k
Cz_usb03 11pF
Rs_usb03 1
Cz_usb03_gnd 220pF
Rs_usb03_gnd 0.9
Lgnd 50pH
Rgnd 100m
Cgnd 0.15pF
Lbump 50pH
Rbump 20m
Cbump 2.4pF
Rsubump 100m
DocID10740 Rev 6 5/8
EMIF02-USB03F2 Package information
8
3 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
3.1 Flip-Chip package information
Figure 12. Flip-Chip package outline
1.44 mm ± 30 µm
1.94 mm ± 30 µm
315 µm ± 50
500 µm
500 µm
650 µm ± 65
220 µm
220 µm
Package information EMIF02-USB03F2
6/8 DocID10740 Rev 6
3.2 Packing information
Figure 13. Flip-Chip tape and reel outline
Note: More information is available in the application notes:
AN1235:”Flip Chip: Package description and recommendations for use”
AN1751: “EMI filters: Recommendations and measurements”
Dot identifying Pin A1 location
User direction of unreeling
All dimensions in mm
4 ± 0.1
8 ± 0.3
4 ± 0.1
1.75 ± 0.1 3.5 ± 0.1
Ø 1.5 ± 0.1
0.73 ± 0.05
xxz
yww
E
ST
xxz
yww
E
ST
xxz
yww
E
ST
2.04
1.58
Figure 14. Footprint Figure 15. Marking
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PUHFRPPHQGHGPPD[
6ROGHUVWHQFLORSHQLQJPUHFRPPHQGHG
6ROGHUPDVNRSHQLQJUHFRPPHQGDWLRQ
PPLQIRUPFRSSHUSDVGLDPHWHU
x
y
x
w
z
w
Dot, ST logo
ECOPACK status
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
P1-P3P4-P6P7-P8

EMIF02-USB03F2

Mfr. #:
Buy EMIF02-USB03F2
Manufacturer:
STMicroelectronics
Description:
EMI Filter Circuits 2-line IPAD EMI 14 VBR 0.2uA 20pF
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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