DMP3036SSS
Document number: DS36460 Rev. 3 - 2
April 2015
© Diodes Incorporated
Maximum Ratings (@T
A
= +25°C, unless otherwise specified.)
Continuous Drain Current (Note 5) V
GS
= -10V
Pulsed Drain Current (10μs pulse, duty cycle = 1%)
Maximum Continuous Body Diode Forward Current (Note 6)
Avalanche Current (Note 7) L = 0.3mH
Avalanche Energy (Note 7) L = 0.3mH
Thermal Characteristics (@T
A
= +25°C, unless otherwise specified.)
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
Thermal Resistance, Junction to Case (Note 6)
Operating and Storage Temperature Range
Electrical Characteristics (@T
A
= +25°C, unless otherwise specified.)
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current T
J
= +25°C
ON CHARACTERISTICS (Note 8)
V
DS
= V
GS
, I
D
= -250μA
Static Drain-Source On-Resistance
DYNAMIC CHARACTERISTICS (Note 9)
V
DS
= -15V, V
GS
= 0V,
f = 1.0MHz
Reverse Transfer Capacitance
V
DS
= 0V, V
GS
= 0V, f = 1MHz
Total Gate Charge at (V
GS
= -5V)
Total Gate Charge at (V
GS
= -10V)
V
GEN
= -10V, V
DD
= -15V,
R
GEN
= 3Ω, I
D
= -10A
Notes: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1-inch square copper plate.
7. IAS and EAS rating are based on low frequency and duty cycles to keep TJ = +25°C.
8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to product testing.