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BSP135H6327XTSA1
P1-P3
P4-P6
P7-P9
BSP135
SIPMOS
®
Small-Signal-Transis
tor
Features
• N-channel
• Depletion mode
• d
v
/d
t
rated
• Availab
le with
V
GS(th)
indicator on reel
• Pb-free lead plating
; RoHS compliant
• Qualified according to AEC Q101
Maximum ratings,
at
T
j
=25 °C, unless otherw
ise specified
Parameter
Symbol
Conditions
Unit
Continuous drain current
I
D
T
A
=25 °C
0.12
A
T
A
=70 °C
0.10
Pulsed drain current
I
D,pulse
T
A
=25 °C
0.48
Reverse diode d
v
/d
t
d
v
/d
t
I
D
=0.12 A,
V
DS
=20 V,
d
i
/d
t
=20
0 A/µs,
T
j,max
=150 °C
6
kV/µs
Gate source voltage
V
GS
±20
V
ESD Class
(JESD22-A114-HBM)
1A(>250V,<
500V)
Power dissipati
on
P
tot
T
A
=25 °C
1.8
W
Operating and storage temperature
T
j
,
T
stg
-55 ... 150
°C
IEC climatic category; DIN IE
C 68-1
55/150/56
1)
see table
on next page and di
agram 11
Value
V
DS
600
V
R
DS(on),max
60
W
I
DSS,min
0.
02
A
Product Summary
PG
-SOT
223
Type
Package
Tape and Reel Information
Marking
Packaging
BSP
135
PG
-SOT
223
L
6327
:
1000
pc
s/reel
BSP
135
Non dry
BSP
135
PG
-SOT
223
L
6906
:
1000
pc
s/reel
BSP
135
Non dry
Type
Package
Tape and Reel Inform
ation
Marking
Packaging
BSP
135
PG
-SOT
223
H
6327
:
1000
pc
s/reel
BSP
135
Non dry
BSP
135
PG
-SOT
223
H
6906
:
1000
pc
s/reel
sorted in
V
GS(th)
bands
1)
BSP
135
Non dry
Rev. 1.3
3
page 1
2012-
11
-2
9
•
HalogenfreeaccordingtoIEC61249221
BSP135
Parameter
Symbol
Conditions
Unit
min.
typ.
max.
Thermal characteristics
Therm
al resistance,
junction - soldering point
(pin 4)
R
thJS
-
-
25
K/W
SMD version, devi
ce on PCB
R
thJA
minim
al footprint
-
-
115
6 cm
2
cooling area
2)
-
-
70
Electrical characteristics,
at
T
j
=25 °C, unless otherw
ise specified
Static characteristics
Drain-source breakdown voltage
V
(BR)DSS
V
GS
=-3 V,
I
D
=250 µA
600
-
-
V
Gate threshold voltag
e
V
GS(th)
V
DS
=3 V,
I
D
=94 µA
-2.1
-1.4
-1
Drain-source cutoff
current
I
D(off)
V
DS
=600 V,
V
GS
=-3 V,
T
j
=25 °C
-
-
0.1
µA
V
DS
=600 V,
V
GS
=-3 V,
T
j
=125 °C
-
-
10
Gate-source leakage current
I
GSS
V
GS
=20 V,
V
DS
=0 V
-
-
100
nA
On-state drain current
I
DSS
V
GS
=0 V,
V
DS
=10 V
20
-
-
mA
Drain-source on-state resistance
R
DS(on)
V
GS
=0 V,
I
D
=0.01A
-
30
60
W
V
GS
=10 V,
I
D
=0.12 A
-
25
45
Transconductance
g
fs
|
V
DS
|>2|
I
D
|
R
DS(on)ma
x
,
I
D
=0.1 A
0.08
0.16
-
S
Threshold vo
ltage
V
GS(th)
sorted in bands
3)
J
V
GS(th)
V
DS
=3 V,
I
D
=94 µA
-1.2
-
-1
V
K
-1.35
-
-1.15
L
-1.5
-
-1.3
M
-1.65
-
-1.45
N
-1.8
-
-1.6
drain con
nection. PCB i
s vertical i
n still a
ir.
3)
Each reel c
ontains
transisto
rs out of one
band whose ide
ntifying letter i
s printed
on the reel
label. A sp
ecific
band ca
nnot be ordere
d separate
ly.
Values
2)
Device on 40 m
m x 40 mm x 1.5 mm epo
xy PCB FR4 w
ith 6 cm
2
(single l
ayer, 70 µm thic
k) copper a
rea for
Rev. 1.3
3
page 2
2012-
11
-2
9
BSP135
Parameter
Symbol
Conditions
Unit
min.
typ.
max.
Dynamic characteristics
Input capacitance
C
iss
-
98
146
pF
Output capacitance
C
oss
-
8.5
13
Reverse transfer capacitance
C
rss
-
3.4
5.1
Turn-on delay
time
t
d(on)
-
5.4
8.1
ns
Rise time
t
r
-
5.6
8.4
Turn-of
f delay
time
t
d(off)
-
28
42
Fall time
t
f
-
182
273
Gate Charge Characteristics
Gate to source charge
Q
gs
-
0.24
0.36
nC
Gate to drain charge
Q
gd
-
2.0
3.0
Gate charge total
Q
g
-
3.7
4.9
Gate plateau vol
tage
V
plateau
-
0.20
-
V
Reverse Diode
Diode continous forward current
I
S
-
-
0.12
A
Diode pulse current
I
S,pulse
-
-
0.48
Diode forward voltag
e
V
SD
V
GS
=-3 V,
I
F
=0.12 A,
T
j
=25 °C
-
0.78
1.2
V
Reverse recovery
time
t
rr
-
87
130
ns
Reverse recovery
charge
Q
rr
-
70
104
nC
V
R
=300 V,
I
F
=0.1 A,
d
i
F
/d
t
=100 A/µs
T
A
=25 °C
Values
V
GS
=-3 V,
V
DS
=25 V,
f
=1 MHz
V
DD
=300 V,
V
GS
=-3...5 V,
I
D
=0.1 A,
R
G
=6
W
V
DD
=400 V,
I
D
=0.1 A,
V
GS
=-3 to 5 V
Rev. 1.3
3
page 3
2012-
11
-2
9
P1-P3
P4-P6
P7-P9
BSP135H6327XTSA1
Mfr. #:
Buy BSP135H6327XTSA1
Manufacturer:
Infineon Technologies
Description:
MOSFET N-Ch 600V 120mA SOT-223-3
Lifecycle:
New from this manufacturer.
Delivery:
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