SpecNo.JEFL243C-0015B-01
P6/9
MURATA MFG.CO.,LTD
Reference
Only
16. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
16.1 Flux and Solder
Flux
Use rosin-based flux,(with converting chlorine content 0.06 to 0.1(wt)%. ),
but not highly acidic flux
(with Halogen content exceeding 0.2(wt)% conversion to chlorine).
Do not use water-soluble flux.
Solde
Use Sn-3.0Ag-0.5Cu solde
16.2 Assembling
<Exclusive use of Reflow soldering>
Flow soldering may cause deterioration in insulation resistance.
So, reflow soldering shall be applied for this product.
16.3 Cleaning Conditions
Do not clean after soldering. Some cleaning agents may degrade bonding strength,and
characteristics of products by detaching. If cleaning,please contact us.
16.4 Resin coating
The impedance value may change due to high cure-stress of resin to be used for coating/molding products.
An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or
operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by
hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit.
So, please pay your careful attention when you select resin in case of coating/molding the products with the
resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted
on your board.
16.5 Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to
warping the board.
［Products direction］
Products shall be location the sideways
Direction (Length : a<b) to the mechanical
Stress.
(2)Products location on P.C.B. separation
Products(A,B,C,D) shall be located carefully
so that products are not subject to the
mechanical stress due to warping the board.
Because they may be subjected the mechanical
stress in order of A
CB D.
16.6 Attention Regarding P.C.B. Design
< The Arrangement of Products >
P.C.B. shall be designed so that products are
far from the portion of perforation.
The portion of perforation shall be designed
as narrow as possible, and shall be designed
so as not to be applied the stress in the
case of P.C.B. separation.
Products shall not be arranged on the line
of a series of holes when there are big
holes in P.C.B.
(Because the stress concentrate on the
line of holes.)
〈
Poor example
〉
〈
Good example
〉
b
a
Seam
Slit
A
D
B
C
b
a
Length:a
b
○
×
×
○
P.C.B.
Portion of
Perforation
Portion of
Perforation
Product
Product
P.C.B.
Hole
○
×
