NCV8560
www.onsemi.com
2
Figure 2. TSOP5 Figure 3. DFN6 (3x3)
(Top View)
1
2
3
5
4
V
in
GND
ENABLE
V
out
ADJ/NC*
1
3
V
in
ADJ/NC*
2
GND
ENABLE
4
V
out
6
(Top View)
* ADJ − Adjustable Version
* NC − Fixed Voltage Version
5
GNDGND
* ADJ − Adjustable Version
* NC − Fixed Voltage Version
Figure 4. DFN6 (2x2.2)
1
3
ENABLE
V
out
2
GND
NC
4
V
in
6
(Top View)
5
GNDGND
PIN FUNCTION DESCRIPTION
Pin No.
Pin Name Description
DFN6
(2x2.2)
DFN6
(3x3)
TSOP−5
3 1 4 ADJ/NC Output Voltage Adjust Input (Adjustable Version), No Connection
(Fixed Voltage Versions) (Note 1)
2, 5, EPAD 2, 5, EPAD 2 GND Power Supply Ground; Device Substrate
4 3 3 ENABLE The Enable Input places the device into low−power standby when pulled to
logic low (< 0.4 V). Connect to V
in
if the function is not used.
6 4 1 V
in
Positive Power Supply Input
1 6 5 V
out
Regulated Output Voltage
1. True no connect. Printed circuit board traces are allowable.
ABSOLUTE MAXIMUM RATINGS
Rating Symbol Min Max Unit
Input Voltage (Note 2) V
in
−0.3 6 V
Output, Enable, Adjustable Voltage V
out
,
ENABLE, ADJ −0.3 V
in
+ 0.3 V V
Maximum Junction Temperature T
J(max)
− 150 °C
Storage Temperature T
STG
−65 150 °C
ESD Capability, Human Body Model (Note 3) ESD
HBM
3500 − V
ESD Capability, Machine Model (Note 3) ESD
MM
200 − V
Moisture Sensitivity Level MSL MSL1/260 −
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
2. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
3. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
Latchup Current Maximum Rating: v150 mA per JEDEC standard: JESD78.
THERMAL CHARACTERISTICS
Rating Symbol Value Unit
Thermal Characteristics, DFN6, 3x3.3 mm (Note 4)
Thermal Resistance, Junction−to−Air (Note 5)
R
q
JA
107
°C/W
Thermal Characteristics, TSOP−5 (Note 4)
Thermal Resistance, Junction−to−Air (Note 5)
R
q
JA
205
°C/W
Thermal Characteristics, DFN6, 2x2.2 mm (Note 4)
Thermal Resistance, Junction−to−Air (Note 5)
R
q
JA
122
°C/W
4. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
5. As measured using a copper heat spreading area of 650 mm
2
, 1 oz copper thickness.
