LTC2054/LTC2055
6
20545fc
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
I
S
Supply Current No Load
●
175 220 µA
V
OS
Input Offset Voltage (Note 3)
●
±10 µV
ΔV
OS
/ΔT
Average Input Offset Drift (Note 3)
●
0.05 ±0.1 µV/°C
Long-Term Offset Drift 50 nV/√mo
I
B
Input Bias Current (Note 4)
●
±3
±12
pA
nA
I
OS
Input Offset Current (Note 4)
●
±6
±5
pA
nA
e
n
Input Noise Voltage R
S
= 100, DC to 1Hz
R
S
= 100, DC to 10Hz
0.6
1.6
µV
P-P
µV
P-P
CMRR Common Mode Rejection Ratio V
CM
= GND to V
+
– 0.9
●
120
110
130 dB
dB
PSRR Power Supply Rejection Ratio V
S
= 2.7V to 11V
●
120
110
130 dB
dB
AVOL Large-Signal Voltage Gain R
L
= 100k, V
OUT
= GND
●
125
115
140 dB
dB
V
OUT
Maximum Output Voltage Swing R
L
= 5k to GND
R
L
= 5k to GND ●
±4.78
±4.675
±4.82 V
V
R
L
= 100k to GND
R
L
= 100k to GND ●
±4.98
±4.965
±4.99 V
V
SR Slew Rate 0.5 V/µs
GBW Gain Bandwidth Product 500 kHz
f
S
Internal Sampling Frequency 1kHz
(LTC2054HVMP) The ● denotes the specifi cations which apply over the full
operating temperature range, otherwise specifi cations are at T
A
= 25°C. V
S
= ±5V unless otherwise noted. (Note 2)
ELECTRICAL CHARACTERISTICS
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: The LTC2054/LTC2055 are designed, characterized and expected to
meet the extended temperature limits of –40°C and 125°C. The LTC2054C/
LTC2055C/LTC2054HVC/LTC2055HVC are guaranteed to meet the
temperature limits of 0°C and 70°C. The LTC2054I/LTC2055I/LTC2054HVI/
LTC2055HVI are guaranteed to meet temperature limits of –40°C and
85°C. The LTC2054H/LTC2055H and LTC2054HVH/LTC2055HVH are
guaranteed to meet the temperature limits of –40°C and 125°C. The
LTC2054MP/LTC2054HVMP are guaranteed to meet the temperature limits
of –55°C and 150°C.
Note 3: These parameters are guaranteed by design. Thermocouple effects
preclude measurements of these voltage levels during automated testing.
Note 4: Limit is determined by high speed automated test capability. See
Typical Characteristic curves for actual typical performance. For tighter
specifi cations, please consult Linear Technology Marketing.
Note 5: The θ
JA
specifi ed for the DD package is with minimal PCB heat
spreading metal. Using expanded metal area on all layers of a board
reduces this value.