ECLAMP2376K.TCT

4© 2008 Semtech Corp.
www.semtech.com
PRELIMINARY
PROTECTION PRODUCTS
EClamp2376K
Device Connection
The EClamp2376K is comprised of six identical circuits
each consisting of a low pass filter for EMI/RFI sup-
pression and dual TVS diodes for ESD protection. The
device is in a 12-pin SLP package. Electrical connec-
tion is made to the 12 pins located at the bottom of
the device. A center tab serves as the ground connec-
tion. The device has a flow through design for easy
layout. Pin connections are noted in Figure 1. All path
lengths should be kept as short as possible to minimize
the effects of parasitic inductance in the board traces.
Recommendations for the ground connection are given
below.
Ground Connection Recommendation
Parasitic inductance present in the board layout will
affect the filtering performance of the device. As
frequency increases, the effect of the inductance
becomes more dominant. This effect is given by
Equation 1.
Equation 1: The Impedance of an Inductor at
Frequency XLF
L*f**2)f,L(XLF π=
Where:
L= Inductance (H)
f = Frequency (Hz)
Via connections to the ground plane form rectangular
wire loops or ground loop inductance as shown in
Figure 2. Ground loop inductance can be reduced by
using multiple vias to make the connection to the
ground plane. Bringing the ground plane closer to the
signal layer (preferably the next layer) also reduces
ground loop inductance. Multiple vias in the device
ground pad will result in a lower inductive ground loop
over two exterior vias. Vias with a diameter d are
separated by a distance y run between layers sepa-
rated by a distance x. The inductance of the loop path
is given by Equation 2. Thus, decreasing distance x
and y will reduce the loop inductance and result in
better high frequency filter characteristics.
niPnoitacifitnedI
6-1seniLtupnI
21-7seniLtuptuO
baTretneCdnuorG
Figure 2 - Inductance of Rectangular Wire Loops
Ground
Via 1
Signal Layer
Ground Layer
Layer
y
x
d
Ground
Via 2
Ground
Via 1
Signal Layer
Ground Layer
Layer
y
x
d
Ground
Via 2
[
]
[]
[
]
d
x*2
d
y*2
9
ln*yln*x*10*16.10)y,x,d(LRECT +=
Where:
d = Diameter of the wire (in)
x = Length of wire loop (in)
y = Breath of wire loop (in)
Equation 2: Inductance of Rectangular Wire Loop
Figure 1 - Pin Identification and Configuration
(Top Side View)
In 1
In 2
In 3
In 4
Out 1
Out 2
Out 3
Out 4
In 5
In 6
Out 5
Out 6
1
67
12
GND
5© 2008 Semtech Corp.
www.semtech.com
PRELIMINARY
PROTECTION PRODUCTS
EClamp2376K
Applications Information
Figure 3 shows the recommended device layout. The
ground pad vias have a diameter of 0.008 inches
(0.20 mm) while the two external vias have a diameter
of 0.010 inches (0.250mm). The internal vias are
spaced approximately evenly from the center of the
pad. The designer may choose to use more vias with a
smaller diameter (such as 0.005 inches or 0.125mm)
since changing the diameter of the via will result in
little change in inductance (i.e. the log function in
Equation 2 in highly insensitive to parameter d) .
Figure 4 shows a typical insertion loss (S21) plot for
the device using Semtech’s filter evaluation board with
50 Ohm traces and the recommended via configura-
tion. Figure 5 shows a typical insertion loss (S21) plot
using a similar board without the internal ground pad
vias. The result is a more inductive ground loop. Note
the “hump” at a frequency of 2.5GHz. This is the
resonant frequency of the higher ground loop induc-
tance.
Figure 3 - Recommended Layout Using Ground Vias
1
2
3
4
START
.
030 MHz
3
STOP 000
.
000 000 MHz
CH1 S21 LOG 6 dB / REF 0 dB
1: -8.9400 dB
288.002 MHz
2: -20.032 dB
900 MHz
3: -23.761 dB
1.8 GHz
4: -16.085 dB
2.5 GHz
0 dB
-6 dB
-12 dB
-18 dB
-24 dB
-30 dB
-36 dB
1
GHz
100
MHz
3
GHz
10
MHz
1
MHz
Figure 5 - Filter Characteristics Using Layout without
Internal Ground Vias
1
2
3
4
START
.
030 MHz
3
STOP 000
.
000 000 MHz
CH1 S21 LOG 6 dB / REF 0 dB
1: -9.1473 dB
297.671 MHz
2: -19.559 dB
900 MHz
3: -30.645 dB
1.8 GHz
4: -34.705 dB
2.5 GHz
0 dB
-6 dB
-12 dB
-18 dB
-24 dB
-30 dB
-36 dB
-42 dB
-48 dB
1
GHz
100
MHz
3
GHz
10
MHz
1
MHz
Figure 4 - Filter Characteristics Using Recommended
Layout with Internal Vias
6© 2008 Semtech Corp.
www.semtech.com
PRELIMINARY
PROTECTION PRODUCTS
EClamp2376K
Applications Information - Spice Model
EClamp2376K Spice Model
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SIpmA51-E251-E2
VBtloV24.724.7
JVtloV577.0577.0
SRmhO00.100.1
VBIpmA3
-E13-E1
OJCdaraF21-E8.921-E8.9
TTces9-E145.29-E145.2
M--642.0642.0
N--1.11.1
GEVe11.111.1
Line In
Line Out
0.7nH
0.7nH

ECLAMP2376K.TCT

Mfr. #:
Manufacturer:
Semtech
Description:
TVS Diodes / ESD Suppressors ESD/EMI PROT FOR COLOR LCD INT
Lifecycle:
New from this manufacturer.
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