© 2016 Eaton
All Rights Reserved
Publication No. 10549 BU-MC16074
August 2016
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approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
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Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/electronics
Technical Data 10549
Effective August 2016
HCM1A0805
Automotive grade high current power inductors
Temperature
t
t
P
t
s
T
C
-5°C
Time 25°C to Peak
Time
°C
T
smin
T
smax
T
L
T
P
Preheat
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Solder reflow profile
Reference JDEC J-STD-020
Profile Feature Standard SnPb Solder Lead (Pb) Free Solder
Preheat and Soak • Temperature min. (T
smin
) 100°C 150°C
• Temperature max. (T
smax
) 150°C 200°C
• Time (T
smin
to T
smax
) (t
s
) 60-120 Seconds 60-120 Seconds
Average ramp up rate T
smax
to T
p
3°C/ Second Max. 3°C/ Second Max.
Liquidous temperature (T
l)
Time at liquidous (t
L
)
183°C
60-150 Seconds
217°C
60-150 Seconds
Peak package body temperature (T
P
)* Table 1 Table 2
Time (t
p
)** within 5 °C of the specified classification temperature (T
c
) 20 Seconds** 30 Seconds**
Average ramp-down rate (T
p
to T
smax
) 6°C/ Second Max. 6°C/ Second Max.
Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max.
* Tolerance for peak profile temperature (T
p
) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (t
p
) is defined as a supplier minimum and a user maximum.
Table 1 - Standard SnPb Solder (T
c
)
Package
Thickness
Volume
mm3
<350
Volume
mm3
≥350
<2.5mm) 235°C 220°C
≥2.5mm 220°C 220°C
Table 2 - Lead (Pb) Free Solder (T
c
)
Package
Thickness
Volume
mm
3
<350
Volume
mm
3
350 - 2000
Volume
mm
3
>2000
<1.6mm 260°C 260°C 260°C
1.6 – 2.5mm 260°C 250°C 245°C
>2.5mm 250°C 245°C 245°C
