Board Level
Heat Sinks
All other products, please contact factory for price, delivery, and minimums.
왖 Normally stocked
44
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
634 SERIES
Slim Profile Unidirectional Fin Vertical Mount Heat Sink
Standard Height Above Footprint
P/N PC Board Dimensions Weight
Plain Pin Without Pin in. (mm) in. (mm) lbs. (grams)
634-10ABP
왖 634-10AB 1.000 (25.4) 0.640 (16.26) x 0.640 (16.26) 0.016 (7.48)
634-15ABP 634-15AB 1.500 (38.1) 0.640 (16.26) x 0.640 (16.26) 0.025 (11.21)
634-20ABP 왖 634-20AB 2.000 (50.8) 0.640 (16.26) x 0.640 (16.26) 0.033 (14.95)
Material: Aluminum, Black Anodized.
These slim profile unidirectional fin heat sinks offer users two assembly alternatives for verti-
cally mounting TO-220 and TO-218 components. Models are available with or without wave-
solderable pins on 0.40 in. (10.2) centers, making them ideal for a variety of applications
where quick assembly is needed and space is at a premium.
TO-220 and TO-218
MECHANICAL DIMENSIONS
634 SERIES
TYPICAL THERMAL PERFORMANCE
FOR 634-15ABP
Dimensions: in. (mm)
637 SERIES
High-Efficiency Heat Sinks For Vertical Board Mounting
Height Above Thermal Performance at Typical Load
Standard PC Board “A” Maximum Footprint Natural Forced Weight
P/N in. (mm) in. (mm) Convection Convection lbs. (grams)
637-10ABP
왖 1.000 (25.4) 1.375 (34.9) x 0.500 (12.7) 76°C @ 6W 5.8°C/W @ 200 LFM 0.023 (10.43)
637-15ABP
왖 1.500 (38.1) 1.375 (34.9) x 0.500 (12.7) 65°C @ 6w 5.5°C/W @ 200 LFM 0.035 (15.88)
637-20ABP
왖 2.000 (50.8) 1.375 (34.9) x 0.500 (12.7) 55°C @ 6W 4.7°C/W @ 200 LFM 0.050 (22.68)
637-25ABP 왖 2.500 (63.5) 1.375 (34.9) x 0.500 (12.7) 48°C @ 6W 4.2°C/W @ 200 LFM 0.062 (28.12)
Material: Aluminum, Black Anodized
Wave-solderable pins on 1 in. centers for vertical mounting on printed circuit boards.
Maximum semiconductor package width 0.625 in. (15.9). Use this heat sink where weight
and board space occupied must be minimized. Refer to the Accessory products section for
thermal interface materials, thermal compounds, and other accessories products.
TO-220
MECHANICAL DIMENSIONS
637 SERIES
(EXTRUSION PROFILE 5183)
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
Dimensions: in. (mm)
Notes:
1. Thermal compound is
assumed between device
and heat sink.
2. Tab temp with longer heat
sink (634-20ABP) will
typically be about 15%
cooler. Tab temp with
shorter heat sink
(634- I0ABP) will typically
be about 25% higher.
