MAX1110/MAX1111
+2.7V, Low-Power, Multichannel,
Serial 8-Bit ADCs
______________________________________________________________________________________ 19
20
19
18
17
16
15
14
13
1
2
3
4
5
6
7
8
V
DD
SCLK
CS
DIN
CH3
CH2
CH1
CH0
TOP VIEW
SSTRB
DOUT
DGND
AGND
CH7
CH6
CH5
CH4
12
11
9
10
REFOUT
REFIN
SHDN
COM
MAX1110
SSOP
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
V
DD
SCLK
CS
DIN
SSTRB
DOUT
DGND
AGND
CH0
CH1
CH2
CH3
COM
SHDN
REFIN
REFOUT
MAX1111
QSOP
+
+
Pin Configurations
Chip Information
PROCESS: CMOS
SUBSTRATE CONNECTED TO DGND
Package Information
For the latest package outline information and land patterns
(footnote), go to www.maxim-ic.com/packages. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
20 SSOP A20+1 21-0056 90-0094
16 QSOP E16+1 21-0055 90-0167
Ordering Information
*
Dice are specified at T
A
= +25°C, DC parameters only.
+
Denotes a lead(Pb)-free/RoHS-compliant package.
/V denotes an automotive qualified part.
PART TEMP RANGE PIN-PACKAGE
MAX1110CAP+ 0°C to +70°C 20 SSOP
MAX1110C/D 0°C to +70°C Dice*
MAX1110EAP+ -40°C to +85°C 20 SSOP
MAX1111CEE+ 0°C to +70°C 16 QSOP
MAX1111EEE+ -40°C to +85°C 16 QSOP
MAX1111EEE/V+ -40°C to +85°C 16 QSOP
