LQG15HH2N0S02D Datasheet LQG15HH33NJ02D, LQG15HH3N9S02D, LQG15HH12NJ02D | P7-P9

SpecNo.JELF243B-9101G-01 P.7 / 10

MURATA MFG.CO., LTD

Reference Only

8. △

Caution

8.1 Caution(Rating)

Do not exceed maximum rated current of the product. Thermal stress may be transmitted to the product and

short/open circuit of the product or falling off the product may be occurred.

8.2 Fail-safe

Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be

caused by the abnormal function or the failure of our product.

8.3 Limitation of Applications

Please contact us before using our products for the applications listed below which require especially high

reliability for the prevention of defects which might directly cause damage to the third party's life, body or

property.

(1) Aircraft equipment (6) Transportation equipment (trains, ships, etc.)

(2) Aerospace equipment

(7) Traffic signal equipment

(3) Undersea equipment

(8) Disaster prevention / crime prevention equipment

(4) Power plant control equipment

(9) Data-processing equipment

(5) Medical equipment

(10) Applications of similar complexity and /or reliability

requirements to the applications listed in the above

9. Notice

Products can only be soldered with reflow.

This product is designed for solder mounting.

Please consult us in advance for applying other mounting method such as conductive adhesive.

9.1 Land pattern designing

a 0.4

b 1.4 to 1.5

c 0.5 to 0.6

(in mm)

9.2 Flux, Solder

・Use rosin-based flux.

Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).

Don’t use water-soluble flux.

・Use Sn-3.0Ag-0.5Cu solder.

・Standard thickness of solder paste : 100μm to 150μm.

Chip Coil

Land

Solder Resist

SpecNo.JELF243B-9101G-01 P.8 / 10

MURATA MFG.CO., LTD

Reference Only

9.3 Reflow soldering conditions

・Inductance value may be changed a little due to the amount of solder.

So, the chip coil shall be soldered by reflow so that the solder volume can be controlled.

・Pre-heating should be in such a way that the temperature difference between solder and

product surface is limited to 150°C max. Cooling into solvent after soldering also should be in

such a way that the temperature difference is limited to 100°C max.

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality.

・Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and / or resulting

in the deterioration of product quality.

・Reflow soldering profile

Standard Profile Limit Profile

Pre-heating 150°C～180°C 、90s±30s

Heating above 220°C､30s～60s above 230°C､60s max.

Peak temperature 245°C±3°C 260°C,10s

Cycle of reflow 2 times 2 times

9.4 Reworking with soldering iron

The following conditions must be strictly followed when using a soldering iron.

Pre-heating 150°C,1 min

Tip temperature 350°C max.

Soldering iron output 80W max.

Tip diameter φ3mm max.

Soldering time 3(+1,-0)s

Time 2 times

Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the

crack on the products due to the thermal shock.

9.5 Solder Volume

・ Solder shall be used not to be exceed the upper limits as shown below.

・ Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.

Exceeding solder volume may cause the failure of mechanical or electrical performance.

1/3T≦t≦T

T：thickness of product

9.6 Mount Shock

Over Mechanical stress to products at mounting process causes crack and electrical failure etc.

Upper Limit

Recommendable

Limit Profile

Standard Profile

90s±30s

230℃

260℃

245℃±3℃

220℃

30s～60s

60s max.

180

150

Temp.

(s)

(℃)

Time.

SpecNo.JELF243B-9101G-01 P.9 / 10

MURATA MFG.CO., LTD

Reference Only

9.7 Product’s location

The following shall be considered when designing and laying out P.C.B.'s.

(1) P.C.B. shall be designed so that products are not subjected to the mechanical stress due to

warping the board.

［Products direction］

Products shall be located in the sideways

direction (Length:a＜b) to the mechanical

stress.

(2) Products location on P.C.B. separation

Products (A,B,C,D) shall be located carefully

so that products are not subjected to the

mechanical stress due to warping the board.

Because they may be subjected the mechanical

stress in order of A ＞C＞B  D.

9.8 Cleaning Conditions

Products shall be cleaned on the following conditions.

(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.)

(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance

phenomenon at the mounted products and P.C.B.

Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 min max.

(3) Cleaner

1. Alcohol type cleaner

Isopropyl alcohol (IPA)

2. Aqueous agent

PINE ALPHA ST-100S

(4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent,

products shall be dried completely after rinse with de-ionized water in order to remove the cleaner.

(5) Other cleaning Please contact us.

9.9 Resin coating

The inductance value may change and/or it may affect on the product's performance due to high

cure-stress of resin to be used for coating / molding products. So please pay your careful attention when

you select resin.

In prior to use, please make the reliability evaluation with the product mounted in your application set.

9.10 Handling of a substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or

twisting to the substrate when cropping the substrate, inserting and removing a connector from the

substrate or tightening screw to the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending Twisting

Seam

Slit

Lengh:a<b

〈

Poor example

〉

〈

Good example

〉

P1-P3 P4-P6 P7-P9 P10-P10

LQG15HH2N0S02D

Mfr. #:

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Description:

Fixed Inductors 0402 2.0nH +/-0.3nH 100MHz 0.1ohm

Lifecycle:

New from this manufacturer.

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LQG15HH2N0S02D

LQG15HH2N0S02D

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