General Description
DDR3 SDRAM modules are high-speed, CMOS dynamic random access memory mod-
ules that use internally configured 8-bank DDR3 SDRAM devices. DDR3 SDRAM mod-
ules use DDR architecture to achieve high-speed operation. DDR3 architecture is essen-
tially an 8n-prefetch architecture with an interface designed to transfer two data words
per clock cycle at the I/O pins. A single read or write access for the DDR3 SDRAM mod-
ule effectively consists of a single 8n-bit-wide, one-clock-cycle data transfer at the inter-
nal DRAM core and eight corresponding n-bit-wide, one-half-clock-cycle data transfers
at the I/O pins.
DDR3 modules use two sets of differential signals: DQS, DQS# to capture data and CK
and CK# to capture commands, addresses, and control signals. Differential clocks and
data strobes ensure exceptional noise immunity for these signals and provide precise
crossing points to capture input signals.
Fly-By Topology
DDR3 modules use faster clock speeds than earlier DDR technologies, making signal
quality more important than ever. For improved signal quality, the clock, control, com-
mand, and address buses have been routed in a fly-by topology, where each clock, con-
trol, command, and address pin on each DRAM is connected to a single trace and ter-
minated (rather than a tree structure, where the termination is off the module near the
connector). Inherent to fly-by topology, the timing skew between the clock and DQS sig-
nals can be easily accounted for by using the write-leveling feature of DDR3.
Temperature Sensor with Serial Presence-Detect EEPROM
Thermal Sensor Operations
The temperature from the integrated thermal sensor is monitored and converts into a
digital word via the I
2
C bus. System designers can use the user-programmable registers
to create a custom temperature-sensing solution based on system requirements. Pro-
gramming and configuration details comply with JEDEC standard No. 21-C page 4.7-1,
"Definition of the TSE2002av, Serial Presence Detect with Temperature Sensor."
Serial Presence-Detect EEPROM Operation
DDR3 SDRAM modules incorporate serial presence-detect. The SPD data is stored in a
256-byte EEPROM. The first 128 bytes are programmed by Micron to comply with JE-
DEC standard JC-45, "Appendix X: Serial Presence Detect (SPD) for DDR3 SDRAM Mod-
ules." These bytes identify module-specific timing parameters, configuration informa-
tion, and physical attributes. The remaining 128 bytes of storage are available for use by
the customer. System READ/WRITE operations between the master (system logic) and
the slave EEPROM device occur via a standard I
2
C bus using the DIMM’s SCL (clock)
SDA (data), and SA (address) pins. Write protect (WP) is connected to V
SS
, permanently
disabling hardware write protection. For further information refer to Micron technical
note TN-04-42, "Memory Module Serial Presence-Detect."
4GB, 8GB (x72, ECC, DR) 240-Pin DDR3 VLP UDIMM
General Description
PDF: 09005aef84a97472
jdf18c512_1gx72az.pdf - Rev. C 04/13 EN
10
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2012 Micron Technology, Inc. All rights reserved.
Electrical Specifications
Stresses greater than those listed may cause permanent damage to the module. This is a
stress rating only, and functional operation of the module at these or any other condi-
tions outside those indicated in each device's data sheet is not implied. Exposure to ab-
solute maximum rating conditions for extended periods may adversely affect reliability.
Table 8: Absolute Maximum Ratings
Symbol Parameter Min Max Units
V
DD
V
DD
supply voltage relative to V
SS
–0.4 1.975 V
V
IN
, V
OUT
Voltage on any pin relative to V
SS
–0.4 1.975 V
Table 9: Operating Conditions
Symbol Parameter Min Nom Max Unit Notes
V
DD
V
DD
supply voltage 1.425 1.5 1.575 V
V
REFCA(DC)
Input reference voltage command/
address bus
0.49 × V
DD
0.5 × V
DD
0.51 × V
DD
V
V
REFDQ(DC)
I/O reference voltage DQ bus 0.49 × V
DD
0.5 × V
DD
0.51 × V
DD
V
I
VTT
Termination reference current from V
TT
–600 600 mA
V
TT
Termination reference voltage (DC) –
command/address bus
0.49 × V
DD
-
20mV
0.5 × V
DD
0.51 × V
DD
+
20mV
V 1
I
I
Input leakage current;
Any input 0V V
IN
V
DD
;
V
REF
input 0V V
IN
0.95V
(All other pins not under test =
0V)
Address
inputs, RAS#,
CAS#, WE#, BA
–36 0 36 µA
S#, CKE, ODT,
CK, CK#
–18 0 18
DM –4 0 4
I
OZ
Output leakage current;
0V V
OUT
V
DDQ
;
DQ and ODT are disabled;
ODT is HIGH
DQ, DQS,
DQS#
–10 0 10 µA
I
VREF
V
REF
supply leakage current;
V
REFDQ
= V
DD
/2 or V
REFCA
= V
DD
/2
(All other pins not under test = 0V)
–18 0 18 µA
T
A
Module ambient operating
temperature
Commercial 0 70 °C 2, 3
T
C
DDR3 SDRAM component case
operating temperature
Commercial 0 95 °C 2, 3, 4
Notes:
1. V
TT
termination voltage in excess of the stated limit will adversely affect the command
and address signals’ voltage margin and will reduce timing margins.
2. T
A
and T
C
are simultaneous requirements.
3. For further information, refer to technical note TN-00-08: ”Thermal Applications,”
available on Micron’s Web site.
4. The refresh rate is required to double when 85°C < T
C
95°C.
4GB, 8GB (x72, ECC, DR) 240-Pin DDR3 VLP UDIMM
Electrical Specifications
PDF: 09005aef84a97472
jdf18c512_1gx72az.pdf - Rev. C 04/13 EN
11
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2012 Micron Technology, Inc. All rights reserved.
DRAM Operating Conditions
Recommended AC operating conditions are given in the DDR3 component data sheets.
Component specifications are available on Micron’s web site. Module speed grades cor-
relate with component speed grades, as shown below.
Table 10: Module and Component Speed Grades
DDR3 components may exceed the listed module speed grades; module may not be available in all listed speed grades
Module Speed Grade Component Speed Grade
-2G1 -093
-1G9 -107
-1G6 -125
-1G4 -15E
-1G1 -187E
-1G0 -187
-80C -25E
-80B -25
Design Considerations
Simulations
Micron memory modules are designed to optimize signal integrity through carefully de-
signed terminations, controlled board impedances, routing topologies, trace length
matching, and decoupling. However, good signal integrity starts at the system level.
Micron encourages designers to simulate the signal characteristics of the system's
memory bus to ensure adequate signal integrity of the entire memory system.
Power
Operating voltages are specified at the DRAM, not at the edge connector of the module.
Designers must account for any system voltage drops at anticipated power levels to en-
sure the required supply voltage is maintained.
4GB, 8GB (x72, ECC, DR) 240-Pin DDR3 VLP UDIMM
DRAM Operating Conditions
PDF: 09005aef84a97472
jdf18c512_1gx72az.pdf - Rev. C 04/13 EN
12
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2012 Micron Technology, Inc. All rights reserved.

MT18JDF1G72AZ-1G6E1

Mfr. #:
Manufacturer:
Micron
Description:
MODULE DDR3 SDRAM 8GB 240UDIMM
Lifecycle:
New from this manufacturer.
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