HDC1105W-TR

Product Guide
Product Guide
Product Guide
Electro-Optical Characteristics
Part No.
Water
Clear
TYP. I
F
Wavelength
Spectral Line
Half Width
Forward
Voltage V
F
TYP. MAX. I
F
Reverse
Current
I
R
MAX. V
R
Viewing
Angle
(2
θ
1/2)
Green
Bluish-Green
Blue
140
140
70
70
70
35
10
10
10
522
502
467
525
505
470
30
30
26
10
10
10
3.3
3.3
3.3
3.8
3.8
3.8
10
10
10
100
100
100
5
5
5
InGaN/SiC
InGaN/SiC
InGaN/SiC
HDG1105W
HDC1105W
HDB1105W
Units
mcd
mA
nm mA mA µA V Deg.V
MIN.
λλ
TYP.
Peak
λλ
p
TYP.
Dominant
λλ
d
TYP.
I
F
Luminous
Intensity
I
V
Lens
Color
Emitted
Color
40°
Outline Dimensions
Features
• High brightness (InGaN/SiC) die material
Available in green (525nm), bluish-green (505nm)
and blue (470nm) colors
• Reflow and dip soldering compatible
Available for both standard and reverse mounting
• 1000V minimum ESD protection
Applications
Automotive indicator display
• Various other backlight uses
Anode
Polarity Mark
PCB
Cathode
Cathode Mark
0.5
3.2
0.6 0.6
1.6
0.5
1.55
R0.8
0.3
1.6
(1.6)
(2)
(4.6)
2.3+0.05
1.6
HOLE
1.5
2.1 + 0.05
1.5
HD_1105W Series, Dome Lens Type InGaN/SiC SMT LED
HD_1105W Series, Dome Lens Type InGaN/SiC SMT LED
Material
Unit: mm
Tolerance +
0.1
(Ta=25°C)
Recommended Solder Pad
on a Surface Mount
Recommended Solder Pad
on a reverse mount
Green
HDG
76
20
48
5
Bluish-Green
HDC
76
20
48
5
Absolute Maximum Ratings
Power Dissipation
Forward Current
Peak Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Derating*
Symbol
Pd
I
F
I
FM
V
R
Topr
Tstg
I
F
Blue
HDB
76
20
48
5
mW
mA
mA
V
°C
°C
mA/°C
* Ta=25°C, I
FM
applies for the pulse width 1msec. and duty cycle 1/20.
0.28 (DC) 0.69 (Pulse)
Units
Item
-40 to +85
-40 to +100
Precautions
Please follow these handling precautions to prevent damage to the chip and
ensure its reliability.
1. Soldering conditions:
• Soldering iron
: Temperature at tip of iron: 280°C max. (30W max.)
Soldering time: 3 sec. max.
• Dip soldering: Preheating: 120 ~ 150°C max. (resin surface temp.)
60 ~ 120 sec. max. Bath temperature: 260°C max. Dipping Time: 5 sec. max.
• Reflow Soldering:
2. Cleaning:
• If cleaning is required, use the following solutions for less than 1 minute,
at less than 40°C.
Appropriate chemicals: Ethyl alcohol and isopropyl alcohol.
• Effect of ultrasonic cleaning on the LED resin body differs depending on such
factors as the oscillator output, size of PCB and LED mounting method. The
use of ultrasonic cleaning should be enforced at proper output after confirming
there is no problem.
Product specifications subject to change without notice. PGHD1105W-0301
Stanley Electric Sales of America,Inc.
2660 Barranca Parkway, Irvine, CA 92606
• Tel: 800-LED-LCD1 (533-5231)
Fax: 949-222-0555
Website: www.stanley-electric.com
Operation Heating
Pre-heating
LED Surface Temperature
Temperature
rise: 5°C/sec.
Cooling:
—5°C/sec.
60 to 120 sec.
5 sec. max
0
120
150
240
°C
~
(Ta=25°C)
Operation Current Derating Chart (DC)
DG, DC, DB,
Spatial Distribution
Taping Specifications
(3.45)
(0.25)
(2.1)
Center
Hole
Center
Hole
(1.85)
4+0.1
φ 1.5
+0.1
0
8+0.2
2+0.05
4+0.1
3.5+0.05
1.75+0.1
φ 1.1)
(
Quantity on tape:
2000 pieces
per reel
φ 21+0.8
9+0.3
11.4+1
φ 13+0.2
φ 180
+
0
3
φ 60
+
1
-0
φ 13+0.2
2+0.5
Taping Specifications
φ 1.5
(1.8)
(0.25)
(0.5)
(2.2)
(3.5)
+0.1
0
4+0.1
4+0.1
2+0.05
1.75 + 0.1
3.5+0.05
8+0.2
Center
Hole
φ 1.1)
(
Quantity on tape:
2000 pieces
per reel
Cathode
RR
Direction to pull
Cathode
TR
Direction to pull
for Reverse
Mount Type
for Standard
Mount Type

HDC1105W-TR

Mfr. #:
Manufacturer:
Description:
LED BLUE-GREEN CLEAR SMD
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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