ADG738/ADG739 Data Sheet
Rev. A | Page 16 of 20
8051 INTERFACE TO ADG738/ADG739
A serial interface between the ADG738/ADG739 and the 8051
is shown in Figure 28. TXD of the 8051 drives SCLK of the
ADG738/ADG739, while RXD drives the serial data line, DIN.
P3.3 is a bit-programmable pin on the serial port and is used to
drive
SYNC
.
The 8051 provides the LSB of its SBUF register as the first bit in
the data stream. The user has to ensure that the data in the SBUF
register is arranged correctly as the switch expects MSB first.
When data is to be transmitted to the matrix switch, P3.3 is
taken low. Data on RXD is clocked out of the microcontroller
on the rising edge of TXD and is valid on the falling edge. As a
result no glue logic is required between the ADG738/ADG739
and microcontroller interface.
Figure 28. 8051 Interface to ADG738/ADG739
MC68HC11 INTERFACE TO ADG738/ADG739
Figure 29 shows an example of a serial interface between the
ADG738/ADG739 and the MC68HC11 microcontroller. SCK
of the 68HC11 drives the SCLK of the matrix switch, while the
MOSI output drives the serial data line, DIN.
SYNC
is driven
from one of the port lines, in this case PC7.
Figure 29. MC68HC11 Interface to ADG738/ADG739
The 68HC11 is configured for master mode; MSTR = 1, CPOL
= 0, and CPHA = 1. When data is transferred to the part, PC7 is
taken low, data is transmitted MSB first. Data appearing on the
MOSI output is valid on the falling edge of SCK.
If the user wishes to verify the data previously written to the
input shift register, the DOUT line could be connected to MISO
of the MC68HC11, and with
SYNC
low, the input shift register
would clock data out on the rising edges of SCLK.
ADG738/
ADG739
SCLK
DIN
P3.3
RXD
TXD
80C51/80L51*
*ADDITIONAL PINS OMITTED FOR CLARITY.
SYNC
10758-021
ADG738/
ADG739
SCLK
DIN
PC7
MOSI
SCK
MC68HC11*
*ADDITIONAL PINS OMITTED FOR CLARITY.
SYNC
10758-022
Data Sheet ADG738/ADG739
Rev. A | Page 17 of 20
APPLICATIONS INFORMATION
EXPAND THE NUMBER OF SELECTABLE SERIAL
DEVICES USING AN ADG739
The dual 4-channel ADG739 multiplexer can be used to
multiplex a single chip select line to provide chip selects for
up to four devices on the SPI bus. Figure 30 illustrates the
ADG739 in such a typical configuration. All devices receive
the same serial clock and serial data, but only one device
receives the
SYNC
signal at any one time. The ADG739 is a
serially controlled device also. One bit programmable pin of
the microcontroller is used to enable the ADG739 via
SYNC2
,
while another bit programmable pin is used as the chip select
for the other serial devices,
SYNC1
. Driving
SYNC2
low enables
changes to be made to the addressed serial devices. By
bringing
SYNC1
low, the selected serial device hanging from
the SPI bus is enabled and data will be clocked into its input
shift register on the falling edges of SCLK. The convenient
design of the matrix switch allows for different combinations of
the four serial devices to be addressed at any one time. If more
devices need to be addressed via one chip select line, the
ADG738 is an 8-channel device and would allow further
expansion of the chip select scheme. There may be some digital
feedthrough from the digital input lines because SCLK and DIN
are permanently connected to each device. Using a burst clock
minimizes the effects of digital feedthrough on the analog
channels.
Figure 30. Addressing Multiple Serial Devices Using an ADG739
DAISY-CHAINING MULTIPLE ADG738S
A number of ADG738 matrix switches may be daisy-chained
simply by using the DOUT pin. DOUT is an open-drain output
that should be pulled to the supply with an external resistor.
Figure 31 shows a typical implementation. The
SYNC
pin of
all three parts in the example are tied together. When
SYNC
is brought low, the input shift registers of all parts are enabled,
data is written to the parts via DIN, and clocked through the
shift registers. When the transfer is complete,
SYNC
is brought
high and all switches are updated simultaneously. Further shift
registers may be added in series.
Figure 31. Multiple ADG739 Devices in a Daisy-Chained Configuration
DA
1/2 OF
ADG739
V
DD
SCLK
DIN
SYNC
S1A
S2A
S3A
S4A
SYNC1
DIN
SCLK
DIN
SCLK
DIN
SCLK
DIN
SCLK
DIN
SCLK
ADG739
ADG738
OTHER SPI
DEVICE
SYNC2
FROM
MICRO-
CONTROLLER
OR DSP
OTHER SPI
DEVICE
SYNC
SYNC
SYNC
SYNC
10758-023
SCLK
DIN
DOUT
ADG739
SCLK
DIN
ADG739
SCLK
DIN
TUOD
TUOD
SCLK
DIN
TO OTHER
SERIAL DEVICES
ADG739
V
DD
RR
R
SYNCSYNC SYNC SYNC
10758-024
ADG738/ADG739 Data Sheet
Rev. A | Page 18 of 20
OUTLINE DIMENSIONS
Figure 32. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1, 2
Temperature Range Package Description Package Option
ADG738BRU −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG738BRUZ −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG738BRUZ-REEL −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG738BRUZ-REEL7 −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG738WBRUZ-REEL −40°C to +105°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG739BRU −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG739BRU-REEL7 −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG739BRUZ −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG739BRUZ-REEL −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG739BRUZ-REEL7 −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
1
Z = RoHS Compliant Part.
2
W = Qualified for Automotive Applications.
AUTOMOTIVE PRODUCTS
The ADG738W model is available with controlled manufacturing to support the quality and reliability requirements of automotive
applications. Note that this automotive model may have specifications that differ from the commercial models; therefore, designers
should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in
automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to
obtain the specific Automotive Reliability reports for these models.
16
9
81
PIN 1
SEATING
PLANE
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09
0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB

ADG739BRU-REEL7

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Multiplexer Switch ICs 4:1 100MHz 2.5 Ohm CMOS Serial Cntrld
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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