MCP16321 EVALUATION BOARD
USER’S GUIDE
2011 Microchip Technology Inc. DS52024A-page 17
Appendix B. Bill of Materials
TABLE B-1: BILL OF MATERIALS (BOM)
Qty Reference Description Manufacturer Part Number
1 C1 CAP 22000pF 25V CERAMIC X7R 0603
10%
AVX Corporation 0603YC104KAT2A
2 C2, C3 CAP 10uF 35V CERAMIC X7R 1210 20% Taiyo Yuden GMK325AB7106MM-T
2 C4, C5 CAP 22uF 6.3V CERAMIC X7R 1206 10% Murata GCM31CR70J226KE23L
1 L1 XFL4020 4.7uH Shielded Power Inductor Coilcraft XFL4020-472MEB
1 PCB MCP16321 6V to 24V VIN, 3.3V Printed
Circuit Board
Microchip Technology
Inc.
104-00414
1 R1 RES 10.0 OHM 1/10W 1% 0603 SMD Yageo RC0603FR-0710RL
1 R2, Rbot RES 10.0K OHM 1/10W 1% 0603 SMD Yageo RC0603FR-0710KL
1 Rtop RES 23.2K OHM 1/10W 1% 0603 SMD Yageo RC0603FR-0723K2L
1 U1 MCP16321 High Input Buck Converter
QFN16
Microchip Technology
Inc.
MCP16321
4 VIN, VOUT,
GND, GND
PC TEST POINT COMPACT SMT Keystone 5016
Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The
released BOM used in manufacturing uses all RoHS-compliant components.