SI1405BDH-T1-E3

Vishay Siliconix
Si1405BDH
Document Number: 74634
S10-0645-Rev. B, 22-Mar-10
www.vishay.com
1
P-Channel 1.8 V (G-S) MOSFET
FEATURES
Halogen-free According to IEC 61249-2-21
Definition
TrenchFET
®
Power MOSFET
Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
Load Switch for Portable Devices
Notes:
a. Surface mounted on 1" x 1" FR4 board.
b. t = 5 s.
c. Package limited.
d. Maximum under steady state conditions is 125 °C/W.
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
(Ω)I
D
(A)
c
Q
g
(Typ.)
- 8
0.112 at V
GS
= - 4.5 V - 1.6
3.67 nC0.160 at V
GS
= - 2.5 V - 1.6
0.210 at V
GS
= - 1.8 V - 1.6
Ordering Information: Si1405BDH-T1-E3 (Lead (Pb)-free)
Si1405BDH-T1-GE3 (Lead (Pb)-free and Halogen-free)
SOT-363
SC-70 (6-LEADS)
6
4
1
2
3
5
Top V i ew
D
D
G
D
D
S
Marking Code
BO XX
Lot Traceability
and Date Code
Part #
Code
YY
ABSOLUTE MAXIMUM RATINGS T
A
= 25 °C, unless otherwise noted
Parameter Symbol Limit Unit
Drain-Source Voltage V
DS
- 8
V
Gate-Source Voltage V
GS
± 8
Continuous Drain Current (T
J
= 150 °C)
a, b
T
C
= 25 °C
I
D
-1.6
c
A
T
C
= 70 °C - 1.6
c
T
A
= 25 °C - 1.6
a, b, c
T
A
= 70 °C - 1.6
a, b, c
Pulsed Drain Current (10 µs Pulse Width) I
DM
- 8
c
Continuous Source-Drain Diode Current
a, b
T
C
= 25 °C
I
S
- 1.6
c
T
A
= 25 °C - 1.47
a, b
Maximum Power Dissipation
a, b
T
C
= 25 °C
P
D
2.27
W
T
C
= 70 °C 1.45
T
A
= 25 °C 1.47
a, b
T
A
= 70 °C 0.95
a, b
Operating Junction and Storage Temperature Range T
J
, T
stg
- 55 to 150
°C
Soldering Recommendations (Peak Temperature)
c, d
260
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient
a, d
t 5 s
R
thJA
70 85
°C/W
Maximum Junction-to-Foot (Drain) Steady State
R
thJF
44 55
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Document Number: 74634
S10-0645-Rev. B, 22-Mar-10
Vishay Siliconix
Si1405BDH
Notes:
a. Pulse test; pulse width 300 µs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS T
J
= 25 °C, unless otherwise noted
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Drain-Source Breakdown Voltage V
DS
V
GS
= 0 V, I
D
= - 250 µA - 8 V
V
DS
Temperature Coefficient ΔV
DS
/T
J
I
D
= - 250 µA
- 5.4
mV/°C
V
GS(th)
Temperature Coefficient ΔV
GS(th)
/T
J
1.98
Gate-Source Threshold Voltage V
GS(th)
V
DS
= V
GS
, I
D
= - 250 µA - 0.45 - 0.95 V
Gate-Source Leakage I
GSS
V
DS
= 0 V, V
GS
= - 8 V - 100 nA
Zero Gate Voltage Drain Current I
DSS
V
DS
= - 8 V, V
GS
= 0 V - 1
µA
V
DS
= - 8 V, V
GS
= 0 V, T
J
= 55 °C - 10
On-State Drain Current
a
I
D(on)
V
DS
5 V, V
GS
= - 4.5 V - 8 A
Drain-Source On-State Resistance
a
R
DS(on)
V
GS
= - 4.5 V, I
D
= - 2.8 A 0.091 0.112
ΩV
GS
= - 2.5 V, I
D
= - 2.3 A 0.132 0.160
V
GS
= - 1.8 V, I
D
= - 0.5 A 0.171 0.205
Forward Transconductance
a
g
fs
V
DS
= - 4 V, I
D
= - 2.8 A 4.8 S
Dynamic
b
Input Capacitance C
iss
V
DS
= - 4 V, V
GS
= 0 V, f = 1 MHz
305
pFOutput Capacitance C
oss
108
Reverse Transfer Capacitance C
rss
66
Total Gate Charge Q
g
V
DS
= - 4 V, V
GS
= - 4.5 V, I
D
= - 2.8 A
3.67 5.5
nCGate-Source Charge Q
gs
0.61
Gate-Drain Charge Q
gd
0.98
Gate Resistance R
g
f = 1 MHz 6.3 Ω
Tur n - On D elay T ime t
d(on)
V
DD
= - 4 V, R
L
= 1.78 Ω
I
D
- 2.25 A, V
GEN
= - 4.5 V, R
g
= 1 Ω
10 15
ns
Rise Time t
r
26 39
Turn-Off Delay Time t
d(off)
16 24
Fall Time t
f
7 10.5
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current I
S
T
C
= 25 °C - 1.6
A
Pulse Diode Forward Current I
SM
- 8
Body Diode Voltage V
SD
I
S
= 1.4 A, V
GS
= 0 V - 0.8 - 1.2 V
Body Diode Reverse Recovery Time t
rr
I
F
= - 1.4 A, dI/dt = 100 A/µs, T
J
= 25 °C
23 35 ns
Body Diode Reverse Recovery Charge Q
rr
5.8 8.7 nC
Reverse Recovery Fall Time t
a
6
ns
Reverse Recovery Rise Time t
b
17
Document Number: 74634
S10-0645-Rev. B, 22-Mar-10
www.vishay.com
3
Vishay Siliconix
Si1405BDH
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
Output Characteristics
On-Resistance vs. Drain Current and Gate Voltage
Gate Charge
V
GS
= 2 V
0
2
4
6
8
01234
V
DS
- Drain-to-Source Voltage (V)
- Drain Current (A)I
D
V
GS
= 5 V thru 2.5 V
V
GS
= 1.5 V
0.0
0.1
0.2
0.3
0.4
0.5
02468
- D to S On-Resistance (Ω)
R
DS(on)
I
D
- Drain Current (A)
V
GS
= 4.5 V
V
GS
= 2.5 V
V
GS
= 1.8 V
0
1
2
3
4
5
012345
I
D
= 2.8 A
- Gate-to-Source Voltage (V)
Q
g
- Total Gate Charge (nC)
V
GS
V
DS
= 4 V
V
DS
= 6.4 V
Transfer Characteristics
Capacitance
On-Resistance vs. Junction Temperature
0.0
0.6
1.2
1.8
2.4
3.0
0.0 0.4 0.8 1.2 1.6 2.0
T
J
= 125 °C
V
GS
- Gate-to-Source Voltage (V)
- Drain Current (A)I
D
T
J
= 25 °C
T
J
= - 55 °C
0
100
200
300
400
500
02468
C
rss
C
oss
C
iss
V
DS
- Drain-to-Source Voltage (V)
C - Capacitance (pF)
0.3
0.6
0.9
1.2
1.5
1.8
- 50 - 25 0 25 50 75 100 125 150
T
J
- Junction Temperature (°C)
(Normalized)
- On-Resistance R
DS(on)
V
GS
= 1.8 V, I
D
= 0.5 A
V
GS
= 4.5 V, I
D
= 2.8 A
V
GS
= 2.5 V, I
D
= 2.3 A

SI1405BDH-T1-E3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET RECOMMENDED ALT 781-SI1467DH-T1-GE3
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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