HCM1307-3R3-R

4
Technical Data 10433
Effective September 2015
HCM1307
High current power inductors
www.eaton.com/elx
Core loss vs. B
p-p
Inductance characteristics
0.001
0.010
0.100
1.000
10.000
100 1000 1000
0
Core Loss (mw)
B
p-p
(Gauss)
50kHz
25kHz
200kHz
100kHz
300kHz
500kHz
1MHz
40%
50%
60%
70%
80%
90%
100%
110%
0102030405060708090
% of OCL
HCM1307-R47-R
40%
50%
60%
70%
80%
90%
100%
110%
0510 15 20 25 30 35 40 45 50 55 60 65
% of OCL
I
DC
(Amps)
HCM1307-1R0-R
I
DC
(Amps)
40%
50%
60%
70%
80%
90%
100%
110%
0510 15 20 25 30 35 40 45
% of OCL
HCM1307-3R3-R
I
DC
(Amps)
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/elx
© 2015 Eaton
All Rights Reserved
Printed in USA
Publication No. 10433 BU-MC15009
September 2015
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Technical Data 10433
Effective September 2015
HCM1307
High current power inductors
Temperature
t
t
P
t
s
T
C
-5°C
Time 25°C to Peak
Time
°C
T
smin
T
smax
T
L
T
P
Preheat
A
Max. Ramp Up Rate = C/s
Max. Ramp Down Rate = C/s
Solder reflow profile
Reference JDEC J-STD-020D
Profile Feature Standard SnPb Solder Lead (Pb) Free Solder
Preheat and Soak • Temperature min. (T
smin
) 100°C 150°C
• Temperature max. (T
smax
) 150°C 200°C
• Time (T
smin
to T
smax
) (t
s
) 60-120 Seconds 60-120 Seconds
Average ramp up rate T
smax
to T
p
3°C/ Second Max. 3°C/ Second Max.
Liquidous temperature (Tl)
Time at liquidous (t
L
)
183°C
60-150 Seconds
217°C
60-150 Seconds
Peak package body temperature (T
P
)* Table 1 Table 2
Time (t
p
)** within 5 °C of the specified classification temperature (T
c
) 20 Seconds** 30 Seconds**
Average ramp-down rate (T
p
to T
smax
) 6°C/ Second Max. 6°C/ Second Max.
Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max.
* Tolerance for peak profile temperature (T
p
) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (t
p
) is defined as a supplier minimum and a user maximum.
Table 1 - Standard SnPb Solder (T
c
)
Package
Thickness
Volume
mm3
<350
Volume
mm3
350
<2.5mm) 235°C 220°C
2.5mm 220°C 220°C
Table 2 - Lead (Pb) Free Solder (T
c
)
Package
Thickness
Volume
mm
3
<350
Volume
mm
3
350 - 2000
Volume
mm
3
>2000
<1.6mm 260°C 260°C 260°C
1.6 – 2.5mm 260°C 250°C 245°C
>2.5mm 250°C 245°C 245°C

HCM1307-3R3-R

Mfr. #:
Manufacturer:
Coiltronics / Eaton
Description:
Fixed Inductors 3.3uH 63A MOLDED 2PADS
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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