CAT24C64
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11
PACKAGE DIMENSIONS
WLCSP4, 0.76x0.76
CASE 567JY
ISSUE C
SEATING
PLANE
E
D
A
B
PIN A1
REFERENCE
e
A0.05 BC
0.03 C
0.05 C
4X
b
12
B
A
0.05 C
A
A1
A2
C
TOP VIEW
SIDE VIEW
BOTTOM VIEW
NOTE 4
e
PITCH
0.16
4X
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.40
0.40
RECOMMENDED
1
PACKAGE
OUTLINE
PITCH
DETAIL A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DATUM C, THE SEATING PLANE, IS DEFINED BY THE
SPHERICAL CROWNS OF THE SOLDER BALLS.
4. COPLANARITY APPLIES TO SPHERICAL CROWNS OF
THE SOLDER BALLS.
5. DIMENSION b IS MEASURED AT THE MAXIMUM
CONTACT BALL DIAMETER PARALLEL TO DATUM C.
6. BACKSIDE COATING IS OPTIONAL.
DIM
A
MIN NOM
−−−
MILLIMETERS
A1
D
E
b 0.15 0.155
e 0.40 BSC
−−−
0.04 0.06
A2 0.23 REF
A3 0.025 REF
0.75 0.77
0.75 0.77
MAX
0.16
0.35
0.08
0.79
0.79
A2
DETAIL A
NOTE 6
DIE COAT
(OPTIONAL)
A3
NOTE 5
NOTE 3
A
