Freescale Semiconductor
Product Brief
Document Number: MPC5125PB
Rev. 2, 7/2009
Contents
© Freescale Semiconductor, Inc., 2008, 2009. All rights reserved.
This document contains
preview information on a new
product that may be in a design
phase or under development.
Freescale reserves the right to
change or discontinue this
product without notice.
Designed for telematics systems and high temperature
industrial applications, the MPC5125 32-bit embedded
controller is a device from Freescale Semiconductor's
mobileGT™ family containing the e300 Power
Architecture™
technology core. This core complies with
the Power Architecture embedded category, and
maintains binary compatible with other processors in the
mobileGT product family such as the MPC5121e and
MPC5200B. It offers a robust system performance with
a smaller package size, while bringing you the reliability
and familiarity of the proven Power Architecture
technology. An ecosystem of third-party vendors is
available to help simplify and speed system design. This
document provides an overview of the MPC5125
microcontroller features, including the major functional
components.
1 Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2.1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2.2 Operating Parameters . . . . . . . . . . . . . . . . . . . . . . . 3
2.3 Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.4 Chip Level Features. . . . . . . . . . . . . . . . . . . . . . . . . 3
2.5 Module Features . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.5.1 e300 Processor Core . . . . . . . . . . . . . . . . . . 3
2.5.2 Display Interface Unit (DIU) . . . . . . . . . . . . . 4
2.5.3 USB Controller . . . . . . . . . . . . . . . . . . . . . . . 4
2.5.4 Direct Memory Access (DMA) Controller. . . 4
2.5.5 DDR SDRAM Memory Controller. . . . . . . . . 4
2.5.6 32 KB On-chip SRAM . . . . . . . . . . . . . . . . . 4
2.5.7 Fast Ethernet Controller (FEC) . . . . . . . . . . 4
2.5.8 NAND Flash Interface . . . . . . . . . . . . . . . . . 5
2.5.9 Local Plus Bus (LPC) Interface . . . . . . . . . . 5
2.5.10 Secure Digital Host Controller (SDHC) . . . . 5
2.5.11 Controller Area Network (CAN) . . . . . . . . . . 5
2.5.12 Integrated Circuit Communication (I
2
C) . . . . 5
2.5.13 Programmable Serial Controller (PSC) . . . . 5
2.5.14 J1850 Byte Data Link Controller (BDLC)
Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.5.15 General Purpose I/Os (GPIO) . . . . . . . . . . . 6
2.5.16 On-chip Real-time Clock (RTC) . . . . . . . . . . 6
2.5.17 IC Identification Module (IIM) . . . . . . . . . . . . 6
2.5.18 On-chip Temperature Sensor. . . . . . . . . . . . 6
2.5.19 Power Modes . . . . . . . . . . . . . . . . . . . . . . . . 6
2.5.20 System Timer. . . . . . . . . . . . . . . . . . . . . . . . 7
2.5.21 IEEE 1149.1 Compliant JTAG Boundary Scan. 7
3 Developer Environment. . . . . . . . . . . . . . . . . . . . . . . . . . . 7
MPC5125 Product Brief
