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TCA0372BDP1G

P1-P3P4-P6P7-P9P10-P10
TCA0372, TCA0372B, NCV0372B
http://onsemi.com
7
PIN CONNECTIONS
(Top View)
CASE 648
Output A
V
CC
Output B
V
EE
/GND
Inputs B
Inputs A
GND
GND
GND
GND
GND
GND
GND
GND
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
+
+
-
-
*Pins 4 and 9 to 16 are internally connected.
CASE 751G
V
CC
Output B
NC
V
EE
/GND
NC
Output A
NC
NC
V
EE
/GND
NC
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
(Top View)
(Top View)
Output A
V
EE
/GND
+
-
CASE 626
1
2
3
4
8
7
6
5
+
-
V
CC
Output B
Inputs A
Inputs B
Inputs B
Inputs A
+
-
+
-
CASE 966
V
EE
/GND
NC
Output A
NC
V
EE
/GND
NC
Inputs A
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
(Top View)
V
CC
Output B
NC
V
EE
/GND
Inputs B
NC
V
EE
/GND
+
-
+
-
TCA0372, TCA0372B, NCV0372B
http://onsemi.com
8
PACKAGE DIMENSIONS
PDIP−8
DP1 SUFFIX
CASE 626−05
ISSUE M
14
58
F
NOTE 5
D
e
b
L
A1
A
E3
E
A
TOP VIEW
C
SEATING
PLANE
0.010 CA
SIDE VIEW
END VIEW
END VIEW
NOTE 3
DIM MIN NOM MAX
INCHES
A −−−− −−−− 0.210
A1 0.015 −−−− −−−−
b 0.014 0.018 0.022
C 0.008 0.010 0.014
D 0.355 0.365 0.400
D1 0.005 −−−− −−−−
e 0.100 BSC
E 0.300 0.310 0.325
L 0.115 0.130 0.150
−−−− −−−− 5.33
0.38 −−−− −−−−
0.35 0.46 0.56
0.20 0.25 0.36
9.02 9.27 10.02
0.13 −−−− −−−−
2.54 BSC
7.62 7.87 8.26
2.92 3.30 3.81
MIN NOM MAX
MILLIMETERS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSION E IS MEASURED WITH THE LEADS RE-
STRAINED PARALLEL AT WIDTH E2.
4. DIMENSION E1 DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
E1 0.240 0.250 0.280 6.10 6.35 7.11
E2
E3 −−−− −−−− 0.430 −−−− −−−− 10.92
0.300 BSC 7.62 BSC
E1
D1
M
8X
e/2
E2
c
PDIP−16
DP2 SUFFIX
CASE 648−08
ISSUE T
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE
MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
−A−
B
F
C
S
H
G
D
J
L
M
16 PL
SEATING
18
916
K
PLANE
−T−
M
A
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.740 0.770 18.80 19.55
B 0.250 0.270 6.35 6.85
C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
F 0.040 0.70 1.02 1.77
G 0.100 BSC 2.54 BSC
H 0.050 BSC 1.27 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.130 2.80 3.30
L 0.295 0.305 7.50 7.74
M 0 10 0 10
S 0.020 0.040 0.51 1.01
____
TCA0372, TCA0372B, NCV0372B
http://onsemi.com
9
PACKAGE DIMENSIONS
SOIC−16 WB
CASE 751G−03
ISSUE D
D
14X
B16X
SEATING
PLANE
S
A
M
0.25 B
S
T
16 9
81
h X 45
_
M
B
M
0.25
H8X
E
B
A
e
T
A1
A
L
C
q
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INLCUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 TOTAL IN
EXCESS OF THE B DIMENSION AT MAXIMUM
MATERIAL CONDITION.
DIM MIN MAX
MILLIMETERS
A 2.35 2.65
A1 0.10 0.25
B 0.35 0.49
C 0.23 0.32
D 10.15 10.45
E 7.40 7.60
e 1.27 BSC
H 10.05 10.55
h 0.25 0.75
L 0.50 0.90
q 0 7
__
11.00
16X
0.58
16X
1.62
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
P1-P3P4-P6P7-P9P10-P10

TCA0372BDP1G

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Buy TCA0372BDP1G
Manufacturer:
ON Semiconductor
Description:
Operational Amplifiers - Op Amps 5-40V 1A Output Extended Temp
Lifecycle:
New from this manufacturer.
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