SI7138DP-T1-E3

Vishay Siliconix
Si7138DP
Document Number: 73530
S11-0212-Rev. C, 14-Feb-11
www.vishay.com
1
N-Channel 60 V (D-S) Reduced Q
gd
, Fast Switching MOSFET
FEATURES
Halogen-free According to IEC 61249-2-21
Definition
Low Thermal Resistance PowerPAK
®
Package
100 % R
g
and Avalanche Tested
Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
Primary Side Switch
- Very Low R
g
and Q
gd
, Critical for Minimizing Losses
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
(Ω)
I
D
(A)
a
Q
g
(Typ.)
60
0.0078 at V
GS
= 10 V
30
55
0.009 at V
GS
= 6 V
30
Ordering Information: Si7138DP-T1-E3 (Lead (Pb)-free)
Si7138DP-T1-GE3 (Lead (Pb)-free) and Halogen-free)
rdering Information:
1
2
3
4
5
6
7
8
S
S
S
G
D
D
D
D
6.15 mm
5.15 mm
PowerPAK SO-8
Bottom View
N-Channel MOSFET
G
D
S
Notes:
a. Package limited.
b. Surface mounted on 1” x 1” FR4 board.
c. t = 10 s.
d. See solder profile (
www.vishay.com/ppg?73461). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 65 °C/W.
ABSOLUTE MAXIMUM RATINGS (T
A
= 25 °C, unless otherwise noted)
Parameter Symbol Limit Unit
Drain-Source Voltage
V
DS
60
V
Gate-Source Voltage
V
GS
± 20
Continuous Drain Current (T
J
= 150 °C)
T
C
= 25 °C
I
D
30
A
T
C
= 70 °C
30
T
A
= 25 °C
19.7
b, c
T
A
= 70 °C
15.7
b, c
Pulsed Drain Current
I
DM
80
Continuous Source-Drain Diode Current
T
C
= 25 °C
I
S
30
a
T
A
= 25 °C
4.5
b, c
Avalanche Current
L = 0.1 mH
I
AS
43
Single-Pulse Avalanche Energy
E
AS
93 mJ
Maximum Power Dissipation
T
C
= 25 °C
P
D
96
W
T
C
= 70 °C
61.5
T
A
= 25 °C
5.4
b, c
T
A
= 70 °C
3.5
b, c
Operating Junction and Storage Temperature Range
T
J
, T
stg
- 55 to 150
°C
Soldering Recommendations (Peak Temperature)
d, e
260
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient
b, f
t 10 s
R
thJA
18 23
°C/W
Maximum Junction-to-Case (Drain) Steady State
R
thJC
1.0 1.5
www.vishay.com
2
Document Number: 73530
S11-0212-Rev. C, 14-Feb-11
Vishay Siliconix
Si7138DP
Notes:
a. Pulse test; pulse width 300 µs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS (T
J
= 25 °C, unless otherwise noted)
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Drain-Source Breakdown Voltage
V
DS
V
GS
= 0 V, I
D
= 1 mA
60 V
V
DS
Temperature Coefficient ΔV
DS
/T
J
I
D
= 250 µA
60.5
mV/°C
V
GS(th)
Temperature Coefficient ΔV
GS(th)
/T
J
- 8.4
Gate-Source Threshold Voltage
V
GS(th)
V
DS
= V
GS
, I
D
= 250 µA
24
Gate-Source Leakage
I
GSS
V
DS
= 0 V, V
GS
= ± 20 V
± 100 nA
Zero Gate Voltage Drain Current
I
DSS
V
DS
= 60 V, V
GS
= 0 V
1
µA
V
DS
= 60 V, V
GS
= 0 V, T
J
= 55 °C
10
On-State Drain Current
a
I
D(on)
V
DS
5 V, V
GS
= 10 V
30 A
Drain-Source On-State Resistance
a
R
DS(on)
V
GS
= 10 V, I
D
= 19.7 A
0.0065 0.0078
Ω
V
GS
= 6 V, I
D
= 18 A
0.0073 0.009
Forward Transconductance
a
g
fs
V
DS
= 15 V, I
D
= 19.7 A
84 S
Dynamic
b
Input Capacitance
C
iss
V
DS
= 30 V, V
GS
= 0 V, f = 1 MHz
6900
pFOutput Capacitance
C
oss
470
Reverse Transfer Capacitance
C
rss
200
Total Gate Charge
Q
g
V
DS
= 30 V, V
GS
= 10 V, I
D
= 19.7 A
90 135
nC
V
DS
= 30 V, V
GS
= 6 V, I
D
= 19.7 A
55 83
Gate-Source Charge
Q
gs
27.5
Gate-Drain Charge
Q
gd
11
Gate Resistance
R
g
f = 1 MHz 0.6 0.9 Ω
Tur n - O n Delay Tim e
t
d(on)
V
DD
= 30 V, R
L
= 3 Ω
I
D
10 A, V
GEN
= 6 V, R
g
= 1 Ω
47 70
ns
Rise Time
t
r
120 180
Turn-Off Delay Time
t
d(off)
40 60
Fall Time
t
f
815
Tur n - O n Delay Tim e
t
d(on)
V
DD
= 30 V, R
L
= 3 Ω
I
D
10 A, V
GEN
= 10 V, R
g
= 1 Ω
25 40
Rise Time
t
r
12 20
Turn-Off Delay Time
t
d(off)
50 75
Fall Time
t
f
815
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
I
S
T
C
= 25 °C
30
A
Pulse Diode Forward Current
a
I
SM
80
Body Diode Voltage
V
SD
I
S
= 2.7 A
0.8 1.2 V
Body Diode Reverse Recovery Time
t
rr
I
F
= 10 A, dI/dt = 100 A/µs, T
J
= 25 °C
45 70 ns
Body Diode Reverse Recovery Charge
Q
rr
80 120 nC
Reverse Recovery Fall Time
t
a
30
ns
Reverse Recovery Rise Time
t
b
15
Document Number: 73530
S11-0212-Rev. C, 14-Feb-11
www.vishay.com
3
Vishay Siliconix
Si7138DP
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Output Characteristics
On-Resistance vs. Drain Current and Gate Voltage
Gate Charge
6 V
0
10
20
30
40
50
60
70
80
0.0 0.3 0.6 0.9 1.2 1.5
3 V
V
DS
- Drain-to-Source Voltage (V)
- Drain Current (A)I
D
4 V
5 V
10 V thru 7 V
V
GS
= 6 V
V
GS
= 10 V
0 20406080
I
D
- Drain Current (A)
R
DS(on)
0.0060
0.0064
0.0068
0.0072
0.0076
0.0080
0
2
4
6
8
10
0 20406080100
I
D
= 19.7 A
- Gate-to-Source Voltage (V)
Q
g
- Total Gate Charge (nC)
V
GS
V
DS
= 30 V
V
DS
= 48 V
Transfer Characteristics
Capacitance
On-Resistance vs. Junction Temperature
- 55 °C
0
4
8
12
16
20
012345
T
C
= 125 °C
V
GS
- Gate-to-Source Voltage (V)
- Drain Current (A)I
D
25 °C
C
rss
0
2000
4000
6000
8000
0 102030405060
C
oss
C
iss
V
DS
- Drain-to-Source Voltage (V)
C - Capacitance (pF)
0.6
0.8
1.0
1.2
1.4
1.6
1.8
- 50 - 25 0 25 50 75 100 125 150
V
GS
= 10,6 V
T
J
- Junction Temperature (°C)
R
DS(on)
- On-Resistance
(Normalized)
I
D
= 19.7 A

SI7138DP-T1-E3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET RECOMMENDED ALT 781-SI7478DP-T1-GE3
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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