MC74HC4051A, MC74HC4052A, MC74HC4053A
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13
ORDERING INFORMATION
Device Package Shipping
MC74HC4051ADG
SOIC−16
(Pb−Free)
48 Units / Rail
MC74HC4051ADR2G 2500 Units / Tape & Reel
NLV74HC4051ADR2G* 2500 Units / Tape & Reel
MC74HC4051ADWG
SOIC−16 WIDE
(Pb−Free)
48 Units / Rail
MC74HC4051ADWR2G 1000 Units / Tape & Reel
NLVHC4051ADWR2G* 1000 Units / Tape & Reel
MC74HC4051ADTG
TSSOP−16
(Pb−Free)
96 Units / Rail
MC74HC4051ADTR2G 2500 Units / Tape & Reel
NLVHC4051ADTR2G* 2500 Units / Tape & Reel
NLVHC4051AMNTWG*
(In Development)
QFN16
(Pb−Free)
3000 Units / Tape & Reel
MC74HC4052ADG
SOIC−16
(Pb−Free)
48 Units / Rail
MC74HC4052ADR2G 2500 Units / Tape & Reel
NLV74HC4052ADR2G* 2500 Units / Tape & Reel
MC74HC4052ADWG
SOIC−16 WIDE
(Pb−Free)
48 Units / Rail
MC74HC4052ADWR2G 1000 Units / Tape & Reel
MC74HC4052ADTG
TSSOP−16
(Pb−Free)
96 Units / Rail
MC74HC4052ADTR2G 2500 Units / Tape & Reel
NLV74HC4052ADTR2G* 2500 Units / Tape & Reel
NLVHC4052ADTR2G* 2500 Units / Tape & Reel
NLVHC4052AMNTWG*
(In Development)
QFN16
(Pb−Free)
3000 Units / Tape & Reel
MC74HC4053ADG
SOIC−16
(Pb−Free)
48 Units / Rail
MC74HC4053ADR2G 2500 Units / Tape & Reel
NLV74HC4053ADR2G* 2500 Units / Tape & Reel
MC74HC4053ADWG
SOIC−16 WIDE
(Pb−Free)
48 Units / Rail
NLV74HC4053ADWRG* 1000 Units / Tape & Reel
MC74HC4053ADWR2G 1000 Units / Tape & Reel
NLV74HC4053ADWR2G* 1000 Units / Tape & Reel
MC74HC4053ADTG
TSSOP−16
(Pb−Free)
96 Units / Rail
MC74HC4053ADTR2G 2500 Units / Tape & Reel
NLVHC4053ADTR2G* 2500 Units / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
MC74HC4051A, MC74HC4052A, MC74HC4053A
www.onsemi.com
14
PACKAGE DIMENSIONS
TSSOP−16
CASE 948F
ISSUE B
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 4.90 5.10 0.193 0.200
B 4.30 4.50 0.169 0.177
C 1.20 −−− 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.18 0.28 0.007 0.011
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
____
SECTION N−N
SEATING
PLANE
IDENT.
PIN 1
1
8
16
9
DETAIL E
J
J1
B
C
D
A
K
K1
H
G
DETAIL E
F
M
L
2X L/2
−U−
S
U0.15 (0.006) T
S
U0.15 (0.006) T
S
U
M
0.10 (0.004) V
S
T
0.10 (0.004)
−T−
−V−
−W−
0.25 (0.010)
16X REFK
N
N
7.06
16X
0.36
16X
1.26
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
MC74HC4051A, MC74HC4052A, MC74HC4053A
www.onsemi.com
15
PACKAGE DIMENSIONS
SOIC−16 WB
CASE 751G−03
ISSUE D
D
14X
B16X
SEATING
PLANE
S
A
M
0.25 B
S
T
16 9
81
h X 45
_
M
B
M
0.25
H8X
E
B
A
e
T
A1
A
L
C
q
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INLCUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 TOTAL IN
EXCESS OF THE B DIMENSION AT MAXIMUM
MATERIAL CONDITION.
DIM MIN MAX
MILLIMETERS
A 2.35 2.65
A1 0.10 0.25
B 0.35 0.49
C 0.23 0.32
D 10.15 10.45
E 7.40 7.60
e 1.27 BSC
H 10.05 10.55
h 0.25 0.75
L 0.50 0.90
q 0 7
__
11.00
16X
0.58
16X
1.62
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

MC74HC4053ADTG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Multiplexer Switch ICs 2-6V ANLG Mux/Demux -55 to 125deg C
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union