Characteristics STPS140-Y
4/9 Doc ID 17973 Rev 1
Figure 7. Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMA)
Figure 8. Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMB)
1E-2 1E-1 1E+0 1E+1 1E+2
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
Z/R
th(j-c) th(j-c)
T
δ
=tp/T
tp
t (s)
p
δ = 0.5
δ = 0.2
δ = 0.1
Single pulse
Epoxy printed circuit board, copper thickness: 35 µm
reccomended pad layout
1E-2 1E-1
1E+0
1E+1 1E+2
1E+3
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
Z/R
th(j-c) th(j-c)
T
δ
=tp/T
tp
t (s)
p
δ = 0.5
δ = 0.2
δ = 0.1
Single pulse
Epoxy printed circuit board, copper thickness: 35 µm
reccomended pad layout
Figure 9. Reverse leakage current versus
reverse voltage applied
(typical values)
Figure 10. Junction capacitance versus
reverse voltage applied
(typical values)
0 5 10 15 20 25 30 35 40
1E-2
1E-1
1E+0
1E+1
1E+2
1E+3
I (µA)
R
V (V)
R
T =125°C
j
T =75°C
j
T =25°C
j
12 51020 50
10
20
50
100
200
C(pF)
V (V)
R
F=1MHz
T =25°C
j
Figure 11. Forward voltage drop versus
forward current (maximum values)
Figure 12. Thermal resistance junction to
ambient versus copper surface
under each lead (SMA)
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
1E-2
1E-1
1E+0
1E+1
I (A)
FM
V (V)
FM
T =125°C
j
012345
0
20
40
60
80
100
120
140
S(Cu)(cm²)
R (°C/W)
th(j-a)
P=1.5W
Epoxy printed circuit board FR4, copper thickness: 35 µm
reccomended pad layout
