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B57550G1104H000

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P26
1.3.4 Recommended geometry of solder pads
Recommended maximum dimensions (mm)
Case size
inch/mm
A B C
0402/1005 0.6 0.6 1.7
0603/1608 1.0 1.0 3.0
0805/2012 1.3 1.2 3.4
1206/3216 1.8 1.2 4.5
2 Conductive adhesion
An alternative to soldering for silver-palladium terminated components is the gluing of thermistors
with conductive adhesives. The benefit of this method is that it involves no thermal stress. The
adhesives used must be chemically inert.
3 Clamp contacting
Pressure contacting by means of clamps is particularly suitable for applications involving frequent
switching and high turn-on powers.
4 Robustness of terminations (leaded types)
The leads meet the requirements of IEC 60068-2-21. They may not be bent closer than 4 mm
from the solder joint on the thermistor body or from the point at which they leave the feed-
throughs. During bending, any mechanical stress at the outlet of the leads must be removed. The
bending radius should be at least 0.75 mm.
Temperature measurement B57550G1
Glass-encapsulated sensors G1550
Page 16 of 26Please read Cautions and warnings and
Important notes at the end of this document.
Tensile strength: Test Ua1:
Value of applied force for Ua1 test:
Diameter (d) of
corresponding round leads
Force with tolerance of ±10%
∅ ≤ 0.25 mm 1.0 N
0.25 < ∅ ≤ 0.35 mm 2.5 N
0.35 < ∅ ≤ 0.50 mm 5.0 N
0.50 < ∅ ≤ 0.80 mm 10.0 N
Bending strength: Test Ub:
Two 90°-bends in opposite directions
Value of applied force for Ub test:
Diameter (d) of
corresponding round leads
Force with tolerance of ±10%
∅ ≤ 0.25 mm 0.5 N
0.25 < ∅ ≤ 0.35 mm 1.25 N
0.35 < ∅ ≤ 0.50 mm 2.5 N
0.50 < ∅ ≤ 0.80 mm 5 N
Torsional strength: Test Uc: severity 2
The lead is bent by 90° at a distance of 6 to 6.5 mm from the thermistor body.
The bending radius of the leads should be approx. 0.75 mm. Two torsions of
180° each (severity 2).
When subjecting leads to mechanical stress, the following should be observed:
Tensile stress on leads
During mounting and operation tensile forces on the leads are to be avoided.
Bending of leads
Bending of the leads directly on the thermistor body is not permissible.
A lead may be bent at a minimum distance of twice the wire's diameter +4 mm from the solder
joint on the thermistor body. During bending the wire must be mechanically relieved at its outlet.
The bending radius should be at least 0.75 mm.
Temperature measurement B57550G1
Glass-encapsulated sensors G1550
Page 17 of 26Please read Cautions and warnings and
Important notes at the end of this document.
5 Sealing and potting
Sealing or potting processes can affect the reliability of the component.
When thermistors are sealed, potted or overmolded, there must be no mechanical stress caused
by thermal expansion during the production process (curing / overmolding process) and during
later operation. The upper category temperature of the thermistor must not be exceeded. Ensure
that the materials used (sealing / potting compound and plastic material) are chemically neutral.
As thermistors are temperature sensitive components it should be considered that molding can af-
fect the thermal surrounding and may influence e.g. the response time.
Extensive testing is encouraged in order to determine whether overmolding or potting influences
the functionality and/ or reliability of the component.
6 Cleaning
Cleaning processes can affect the reliability of the component.
If cleaning is necessary, mild cleaning agents are recommended. Cleaning agents based on wa-
ter are not allowed. Washing processes may damage the product due to the possible static or
cyclic mechanical loads (e.g. ultrasonic cleaning). They may cause cracks which might lead to re-
duced reliability and/ or lifetime.
7 Storage
In order to maintain their solderability, thermistors must be stored in a non-corrosive atmosphere.
Humidity, temperature and container materials are critical factors.
Do not store SMDs where they are exposed to heat or direct sunlight. Otherwise, the packing ma-
terial may be deformed or SMDs may stick together, causing problems during mounting. After
opening the factory seals, such as polyvinyl-sealed packages, use the SMDs as soon as possible.
The components should be left in the original packing. Touching the metallization of unsoldered
thermistors may change their soldering properties.
Storage temperature: 25 °C up to 45 °C
Relative humidity (without condensation): ≤75% annual mean
<95%, maximum 30 days per annum
Solder the thermistors listed in this data book after shipment from EPCOS within the time speci-
fied:
SMDs with AgPd termination: 6 months
SMDs with nickel barrier termination: 12 months
Leadless components: 12 months
Leaded components: 24 months
Temperature measurement B57550G1
Glass-encapsulated sensors G1550
Page 18 of 26Please read Cautions and warnings and
Important notes at the end of this document.
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P26

B57550G1104H000

Mfr. #:
Buy B57550G1104H000
Manufacturer:
EPCOS / TDK
Description:
NTC Thermistors G550/ 100 K/ 3% NTC Thermistor
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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