LQA12T300C, LQA12B300C
Qspeed
™
Family
300 V, 12 A Q-Series Common-Cathode Diode
www.powerint.com January 2011
Product Summary
I
F(AVG)
per diode 6 A
V
RRM
300 V
Q
RR
(Typ at 125 °C) 27 nC
I
RRM
(Typ at 125 °C) 1.87 A
Softness t
b
/t
a
(Typ at 125 °C) 0.7
TO-220AB TO-263AB
LQA12T300C LQA12B300C
RoHS Compliant
Package uses Lead-free plating and “Green” mold
compound Halogen free per IEC 61249-2-21.
General Description
This device has the lowest Q
RR
of any 300 V
Silicon diode. Its recovery characteristics
increase efficiency, reduce EMI and eliminate
snubbers.
Applications
• AC/DC and DC/DC output rectification
• Output & freewheeling diodes
• Motor drive circuits
• DC-AC inverters
Features
• Low Q
RR
, Low I
RRM
, Low t
RR
• High dI
F
/dt capable (1000A/µs)
• Soft recovery
Benefits
• Increases efficiency
• Eliminates need for snubber circuits
• Reduces EMI filter component size & count
• Enables extremely fast switching
Absolute Maximum Ratings
Absolute maximum ratings are the values beyond which the device may be damaged or have its useful life impaired. Functional
operation under these conditions is not implied.
Symbol Parameter Conditions Rating Units
V
RRM
Peak repetitive reverse voltage 300 V
I
F(AVG)
Average forward current Per Diode, T
J
= 150 °C, T
C
= 117°C 6 A
Per Device, T
J
= 150 °C, T
C
= 117°C 12 A
I
FSM
Non-repetitive peak surge current Per Diode, 60 Hz, ½ cycle 37 A
I
FSM
Non-repetitive peak surge current
Per Diode, ½ cycle of t = 28 µs Sinusoid,
T
C
= 25 °C
350 A
T
J
Maximum junction temperature 150 °C
T
STG
Storage temperature –55 to 150 °C
Lead soldering temperature Leads at 1.6mm from case, 10 sec 300 °C
P
D
Power dissipation T
C
= 25 °C 33.8 W
Thermal Resistance
Symbol Resistance from: Conditions Rating Units
R
θ
JA
Junction to ambient TO-220AB (only) 62 °C/W
Per Diode 3.7 °C/W
R
θ
JC
Junction to case
Per Device 1.9 °C/W
Pin Assignment
A1
K
A2
A1
K
A2