AT45DB011
4
MAIN MEMORY PAGE TO BUFFER TRANSFER: A page
of data can be transferred from the main memory to buffer.
An 8-bit opcode of 53H is followed by the six reserved bits,
nine address bits (PA8-PA0) which specify the page in
main memory that is to be transferred, and nine dont care
bits. The CS
pin must be low while toggling the SCK pin to
load the opcode, the address bits, and the dont care bits
from the SI pin. The transfer of the page of data from the
main memory to the buffer will begin when the CS
pin tran-
sitions from a low to a high state. During the transfer of a
page of data (t
XFR
), the status register can be read to deter-
mine whether the transfer has been completed or not.
MAIN MEMORY PAGE TO BUFFER COMPARE: A page
of data in main memory can be compared to the data in the
buffer. An 8-bit opcode of 60H is followed by 24 address
bits consisting of the six reserved bits, nine address bits
(PA8-PA0) which specify the page in the main memory that
is to be compared to the buffer, and nine dont care bits.
The loading of the opcode and the address bits is the same
as described previously. The CS
pin must be low while tog-
gling the SCK pin to load the opcode, the address bits, and
the dont care bits from the SI pin. On the low-to-high tran-
sition of the CS
pin, the 264 bytes in the selected main
memory page will be compared with the 264 bytes in the
buffer. During this time (t
XFR
), the status register will indi-
cate that the part is busy. On completion of the compare
operation, bit 6 of the status register is updated with the
result of the compare.
Program
BUFFER WRITE: Data can be shifted in from the SI pin
into the data buffer. To load data into the buffer, an 8-bit
opcode of 84H is followed by 15 dont care bits and nine
address bits (BFA8-BFA0). The nine address bits specify
the first byte in the buffer to be written. The data is entered
following the address bits. If the end of the data buffer is
reached, the device will wrap around back to the beginning
of the buffer. Data will continue to be loaded into the buffer
until a low-to-high transition is detected on the CS
pin.
BUFFER TO MAIN MEMORY PAGE PROGRAM WITH
BUILT-IN ERASE: Data written into the buffer can be pro-
grammed into the main memory. An 8-bit opcode of 83H is
followed by the six reserved bits, nine address bits (PA8-
PA0) that specify the page in the main memory to be writ-
ten, and nine additional dont care bits. When a low-to-high
transition occurs on the CS
pin, the part will first erase the
selected page in main memory to all 1s and then program
the data stored in the buffer into the specified page in the
main memory. Both the erase and the programming of the
page are internally self-timed and should take place in a
maximum time of t
EP
. During this time, the status register
will indicate that the part is busy.
BUFFER TO MAIN MEMORY PAGE PROGRAM WITH-
OUT BUILT-IN ERASE: A previously erased page within
main memory can be programmed with the contents of the
buffer. An 8-bit opcode of 88H is followed by the six
reserved bits, nine address bits (PA8-PA0) that specify the
page in the main memory to be written, and nine additional
dont care bits. When a low-to-high transition occurs on the
CS
pin, the part will program the data stored in the buffer
into the specified page in the main memory. It is necessary
that the page in main memory that is being programmed
has been previously erased. The programming of the page
is internally self-timed and should take place in a maximum
time of t
P
. During this time, the status register will indicate
that the part is busy.
PAGE ERASE: The optional Page Erase command can be
used to individually erase any page in the main memory
array allowing the Buffer to Main Memory Page Program
without Built-in Erase command to be utilized at a later
time. To perform a Page Erase, an opcode of 81H must be
loaded into the device, followed by six reserved bits, nine
address bits (PA8-PA0), and nine dont care bits. The nine
address bits are used to specify which page of the memory
array is to be erased. When a low-to-high transition occurs
on the CS
pin, the part will erase the selected page to 1s.
The erase operation is internally self-timed and should take
place in a maximum time of t
PE
. During this time, the status
register will indicate that the part is busy.
BLOCK ERASE: A block of eight pages can be erased at
one time allowing the Buffer to Main Memory Page Pro-
gram without Built-in Erase command to be utilized to
reduce programming times when writing large amounts of
data to the device. To perform a Block Erase, an opcode of
50H must be loaded into the device, followed by six
reserved bits, six address bits (PA8-PA3), and 12 dont
care bits. The six address bits are used to specify which
block of eight pages is to be erased. When a low-to-high
transition occurs on the CS
pin, the part will erase the
selected block of eight pages to 1s. The erase operation is
internally self-timed and should take place in a maximum
time of t
BE
. During this time, the status register will indicate
that the part is busy.
AT45DB011
5
MAIN MEMORY PAGE PROGRAM: This operation is a
combination of the Buffer Write and Buffer to Main Memory
Page Program with Built-in Erase operations. Data is first
shifted into the buffer from the SI pin and then programmed
into a specified page in the main memory. An 8-bit opcode
of 82H is followed by the six reserved bits and 18 address
bits. The nine most significant address bits (PA8-PA0)
select the page in the main memory where data is to be
written, and the next nine address bits (BFA8-BFA0) select
the first byte in the buffer to be written. After all address bits
are shifted in, the part will take data from the SI pin and
store it in the data buffer. If the end of the buffer is reached,
the device will wrap around back to the beginning of the
buffer. When there is a low-to-high transition on the CS
pin,
the part will first erase the selected page in main memory to
all 1s and then program the data stored in the buffer into
the specified page in the main memory. Both the erase and
the programming of the page are internally self timed and
should take place in a maximum of time t
EP
. During this
time, the status register will indicate that the part is busy.
AUTO PAGE REWRITE: This mode is only needed if multi-
ple bytes within a page or multiple pages of data are
modified in a random fashion. This mode is a combination
of two operations: Main Memory Page to Buffer Transfer
and Buffer to Main Memory Page Program with Built-in
Erase. A page of data is first transferred from the main
memory to the data buffer, and then the same data (from
the buffer) is programmed back into its original page of
main memory. An 8-bit opcode of 58H is followed by the six
reserved bits, nine address bits (PA8-PA0) that specify the
page in main memory to be rewritten, and nine additional
dont care bits. When a low-to-high transition occurs on the
CS
pin, the part will first transfer data from the page in main
memory to the buffer and then program the data from the
buffer back into same page of main memory. The operation
is internally self-timed and should take place in a maximum
time of t
EP
. During this time, the status register will indicate
that the part is busy.
If a sector is programmed or reprogrammed sequentially
page by page, then the programming algorithm shown in
Figure 1 on page 16 is recommended. Otherwise, if multi-
ple bytes in a page or several pages are programmed
randomly in a sector, then the programming algorithm
shown in Figure 2 on page 17 is recommended.
STATUS REGISTER: The status register can be used to
determine the devices ready/busy status, the result of a
Main Memory Page to Buffer Compare operation, or the
device density. To read the status register, an opcode of
57H must be loaded into the device. After the last bit of the
opcode is shifted in, the eight bits of the status register,
starting with the MSB (bit 7), will be shifted out on the SO
pin during the next eight clock cycles. The five most signifi-
cant bits of the status register will contain device
information, while the remaining three least significant bits
are reserved for future use and will have undefined values.
After bit 0 of the status register has been shifted out, the
sequence will repeat itself (as long as CS
remains low and
SCK is being toggled) starting again with bit 7. The data in
the status register is constantly updated, so each repeating
sequence will output new data.
Ready/Busy status is indicated using bit 7 of the status reg-
ister. If bit 7 is a 1, then the device is not busy and is ready
to accept the next command. If bit 7 is a 0, then the device
is in a busy state. The user can continuously poll bit 7 of the
status register by stopping SCK once bit 7 has been output.
The status of bit 7 will continue to be output on the SO pin,
and once the device is no longer busy, the state of SO will
change from 0 to 1. There are eight operations which can
cause the device to be in a busy state: Main Memory Page
to Buffer Transfer, Main Memory Page to Buffer Compare,
Block Erase Addressing
PA8 PA7 PA6 PA5 PA4 PA3 PA2 PA1 PA0 Block
000000XXX0
000001XXX1
000010XXX2
000011XXX3
111100XXX60
111101XXX61
111110XXX62
111111XXX63
AT45DB011
6
Buffer to Main Memory Page Program with Built-in Erase,
Buffer to Main Memory Page Program without Built-in
Erase, Page Erase, Block Erase, Main Memory Page Pro-
gram, and Auto Page Rewrite.
The result of the most recent Main Memory Page to Buffer
Compare operation is indicated using bit 6 of the status
register. If bit 6 is a 0, then the data in the main memory
page matches the data in the buffer. If bit 6 is a 1, then at
least one bit of the data in the main memory page does not
match the data in the buffer.
The device density is indicated using bits 5, 4, and 3 of the
status register. For the AT45DB011, the three bits are 0, 0,
and 1. The decimal value of these three binary bits does
not equate to the device density; the three bits represent a
combinational code relating to differing densities of Serial
DataFlash devices, allowing a total of eight different density
configurations.
HARDWARE PAGE WRITE PROTECT: If the WP
pin is
held low, the first 256 pages of the main memory cannot be
reprogrammed. The only way to reprogram the first 256
pages is to first drive the protect pin high and then use the
program commands previously mentioned. The WP
pin is
internally pulled high; therefore, in low pin count applica-
tions, connection of the WP
pin is not necessary if this pin
and feature will not be utilized. However, it is recom-
mended that the WP
pin be driven high externally
whenever possible.
RESET
: A low state on the reset pin (RESET) will terminate
the operation in progress and reset the internal state
machine to an idle state. The device will remain in the reset
condition as long as a low level is present on the RESET
pin. Normal operation can resume once the RESET pin is
brought back to a high level.
The device incorporates an internal power-on reset circuit,
so there are no restrictions on the RESET
pin during
power-on sequences. The RESET
pin is also internally
pulled high; therefore, in low pin count applications, con-
nection of the RESET
pin is not necessary if this pin and
feature will not be utilized. However, it is recommended
that the RESET
pin be driven high externally whenever
possible.
READY/BUSY
: This open drain output pin will be driven
low when the device is busy in an internally self-timed oper-
ation. This pin, which is normally in a high state (through an
external pull-up resistor), will be pulled low during program-
ming operations, compare operations, and during page-to-
buffer transfers.
The busy status indicates that the Flash memory array and
the buffer cannot be accessed.
Power-on/Reset State
When power is first applied to the device, or when recover-
ing from a reset condition, the device will default to SPI
Mode 3. In addition, the SO pin will be in a high-impedance
state, and a high-to-low transition on the CS
pin will be
required to start a valid instruction. The SPI mode will be
automatically selected on every falling edge of CS
by sam-
pling the inactive clock state.
Note: 1. After power is applied and V
CC
is at the minimum specified datasheet value, the system should wait 20 ms before an opera-
tional mode is started.
Status Register Format
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
RDY/BUSY
COMP0 01XXX
Absolute Maximum Ratings*
Temperature under Bias ................................ -55°C to +125°C
*NOTICE: Stresses beyond those listed under Absolute
Maximum Ratings may cause permanent dam-
age to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect device
reliability.
Storage Temperature..................................... -65°C to +150°C
All Input Voltages
(including NC Pins)
with Respect to Ground ...................................-0.6V to +6.25V
All Output Voltages
with Respect to Ground .............................-0.6V to V
CC
+ 0.6V
DC and AC Operating Range
AT45DB011
Operating Temperature (Case)
Com. 0
°C to 70°C
Ind. -40
°C to 85°C
V
CC
Power Supply
(1)
2.7V to 3.6V

AT45DB011-XI

Mfr. #:
Manufacturer:
Description:
IC FLASH 1M SPI 15MHZ 14TSSOP
Lifecycle:
New from this manufacturer.
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