STS2DPF80

1/9June 2004
STS2DPF80
DUAL P-CHANNEL 80V - 0.21 - 2.3A SO-8
STripFET™ POWER MOSFET
Rev.0.1
TYPICAL R
DS
(on) = 0.21
STANDARD OUTLINE FOR EASY
AUTOMATED SURFACE MOUNT ASSEMBLY
DESCRIPTION
This application specific Power MOSFET is the
second generation of STMicroelectronis unique
"Single Feature Size™" strip-based process. The
resulting transistor shows extremely high packing
density for low on-resistance, rugged avalanche
characteristics and less critical alignment steps
therefore a remarkable manufacturing reproduc-
ibility
.
APPLICATIONS
DC/DC CONVERTERS
BATTERY MANAGEMENT IN NOMADIC
EQUIPMENT
POWER MANAGEMENT IN CELLULAR
PHONES AND DISPLAY NEW GENERATION
Ordering Information
TYPE
V
DSS
R
DS(on)
I
D
STS2DPF80 80 V <0.25 2.3 A
SALES TYPE MARKING PACKAGE PACKAGING
STS8DPF80 S8DPF80 SO-8 TAPE & REEL
SO-8
ABSOLUTE MAXIMUM RATINGS
(•) Pulse width limited by safe operating area. Note: For the P-CHANNEL MOSFET actual polarity of voltages and
current has to be reversed
Symbol Parameter Value Unit
V
DS
Drain-source Voltage (V
GS
= 0)
80 V
V
DGR
Drain-gate Voltage (R
GS
= 20 k)
80 V
V
GS
Gate- source Voltage ± 20 V
I
D
Drain Current (continuous) at T
C
= 25°C Single Operation
Drain Current (continuous) at T
C
= 100°C Single Operation
2.0
1.3
A
A
I
DM
(•)
Drain Current (pulsed) 8 A
P
tot
Total Dissipation at T
C
= 25°C
2.5 W
T
stg
Storage Temperature -55 to 150 °C
T
j
Max. Operating Junction Temperature 150 °C
INTERNAL SCHEMATIC DIAGRAM
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Obsolete Product(s) - Obsolete Product(s)
Obsolete Product(s) - Obsolete Product(s)
STS2DPF80
2/9
TAB.1 THERMAL DATA
(*)
When Mounted on 1 inch
2
FR-4 board, 2 oz of Cu and t [ 10 sec.
ELECTRICAL CHARACTERISTICS (T
CASE
= 25 °C UNLESS OTHERWISE SPECIFIED)
TAB.2 OFF
TAB.3 ON
(*)
TAB.4 DYNAMIC
Rthj-
PCB
(*)
Thermal Resistance Junction-PCB 62.5 °C/W
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
Drain-source
Breakdown Voltage
I
D
= 250 µA, V
GS
= 0
80 V
I
DSS
Zero Gate Voltage
Drain Current (V
GS
= 0)
V
DS
= Max Rating
V
DS
= Max Rating T
C
= 125°C
1
10
µA
µA
I
GSS
Gate-body Leakage
Current (V
DS
= 0)
V
GS
= ± 20 V
±100 nA
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
GS(th)
Gate Threshold Voltage
V
DS
= V
GS
I
D
= 250 µA
24V
R
DS(on)
Static Drain-source On
Resistance
V
GS
= 10 V I
D
= 1 A
0.21 0.25
Symbol Parameter Test Conditions Min. Typ. Max. Unit
g
fs
(*)
Forward Transconductance
V
DS
= 10V I
D
=1 A
4S
C
iss
C
oss
C
rss
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
V
DS
= 25V, f = 1 MHz, V
GS
= 0
739
89.5
31
pF
pF
pF
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3/9
STS2DPF80
TAB.5 SWITCHING ON
TAB.6 SWITCHING OFF
TAB.7 SOURCE DRAIN DIODE
(*)
Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
()
Pulse width limited by safe operating area.
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(on)
t
r
Turn-on Delay Time
Rise Time
V
DD
= 40 V I
D
= 1 A
R
G
=4.7 V
GS
= 10 V
(Resistive Load, Figure 1)
13.5
18
ns
ns
Q
g
Q
gs
Q
gd
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
V
DD
= 64V I
D
= 2A V
GS
=10V
(See test circuit, Figure 2)
20
2.5
4.9
nC
nC
nC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(off)
t
f
Turn-off Delay Time
Fall Time
V
DD
= 40 V I
D
= 1 A
R
G
=4.7Ω, V
GS
= 10 V
(Resistive Load, Figure 1)
32
13
ns
ns
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
(
)
Source-drain Current
Source-drain Current (pulsed)
2.3
9.2
A
A
V
SD
(*)
Forward On Voltage
I
SD
= 1 A V
GS
= 0
1.2 V
t
rr
Q
rr
I
RRM
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
I
SD
= 2 A di/dt = 100A/µs
V
DD
= 40 V T
j
= 150°C
(See test circuit, Figure 3)
47
87
3.7
ns
nC
A
ELECTRICAL CHARACTERISTICS (continued)
Safe Operating Area
Thermal Impedance
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STS2DPF80

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
MOSFET DUAL P Ch 80V 0.21 OHM 2.3A
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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