74SSTVF16859NLG

4
COMMERCIAL TEMPERATURE RANGE
IDT74SSTVF16859
13-BIT TO 26-BIT REGISTERED BUFFER WITH SSTL I/O
Symbol Parameter Test Conditions Min. Typ. Max. Unit
VIK Control Inputs VDD = 2.5V, II= 18mA –1.2 V
VOH VDD = 2.5V to 2.7V, IOH = -100μAVDD – 0.2 V
VDD = 2.5V, IOH = -8mA 1.95
V
OL VDD = 2.5V to 2.7V, IOL = 100μA 0.2 V
VDD = 2.5V, IOL = 8mA 0.35
II All Inputs VDD = 2.7V,VI = VDD or GND ±5 μA
I
DD Static Standby IO = 0, VDD = 2.7V, RESET = GND 0.01 mA
Static Operating IO = 0, VDD = 2.7V, RESET = VDD, VI = VIH (AC) or VIL (AC) ——20
Dynamic Operating (Clock Only) I
O = 0, VDD = 2.7V, RESET = VDD, VI = VIH (AC) or VIL (AC),—6μA/Clock
CLK and CLK Switching 50% Duty Cycle. MHz
IDDD Dynamic Operating IO = 0, VDD = 2.7V, RESET = VDD, VI = VIH (AC) or VIL (AC),—43μA/Clock
(Per Each Data Input)
(1)
CLK and CLK Switching 50% Duty Cycle. One Data Input MHz/Data
Switching at Half Clock Frequency, 50% Duty Cycle. Input
Data Inputs VDD = 2.6V, VI = VREF ± 310mV 2 3
C
I CLK and CLK VICR = 1.3V, VI (PP) = 360mV 2 3 pF
RESET V
I = VDD or GND 2 3
NOTE:
1. Power dissipation levels will allow operation at DDR400 speeds without excessive die temperature.
DC ELECTRICAL CHARACTERISTICS OVER OPERATING RANGE FOR PC3200
Following Conditions Apply Unless Otherwise Specified:
Operating Condition: TA = 0°C to +70°C, VDD = 2.6V ±0.1V, VDDQ = 2.6V ±0.1V
OPERATING CHARACTERISTICS, TA = 25ºC
(1)
Symbol Parameter Min. Typ.
(1)
Max. Unit
VDD Supply Voltage VDDQ 2.7 V
VDDQ Output Supply Voltage PC1600-PC2700 2.3 2.5 2.7 V
PC3200 2.5 2.6 2.7
V
REF Reference Voltage (VREF= VDDQ/2) PC1600-PC2700 1.15 1.25 1.35 V
PC3200 1.25 1.3 1.35
VTT Termination Voltage VREF– 40mV VREF VREF+ 40mV V
VI Input Voltage 0 VDD V
VIH AC High-Level Input Voltage Data Inputs VREF+ 310mV V
VIL AC Low-Level Input Voltage Data Inputs VREF– 310mV V
VIH DC High-Level Input Voltage Data Inputs VREF+ 150mV V
VIL DC Low-Level Input Voltage Data Inputs VREF– 150mV V
VIH High-Level Input Voltage RESET 1.7 V
VIL Low-Level Input Voltage RESET 0.7 V
VICR Common-Mode Input Range CLK, CLK 0.97 1.53 V
VI (PP) Peak-to-Peak Input Voltage CLK, CLK 360 mV
IOH High-Level Output Current 16 mA
IOL Low-Level Output Current 16
T
A Operating Free-Air Temperature 0 +70 ° C
NOTE:
1. The RESET input of the device must be held at VDD or GND to ensure proper device operation.
5
COMMERCIAL TEMPERATURE RANGE
IDT74SSTVF16859
13-BIT TO 26-BIT REGISTERED BUFFER WITH SSTL I/O
TIMING REQUIREMENTS OVER RECOMMENDED OPERATING FREE-AIR
TEMPERATURE RANGE
PC1600 - PC2700 PC3200
Symbol Parameter Min. Max. Min. Max. Unit
CLOCK Clock Frequency 200 220 MHz
tw Pulse Duration, CLK, CLK HIGH or LOW 2.5 2.5 ns
tACT Differential Inputs Active Time
(1)
—2222ns
tINACT Differential Inputs Inactive Time
(2)
—2222ns
tSU Setup Time, Fast Slew Rate
(3, 5)
Data Before CLK, CLK 0.65 0.65 ns
Setup Time, Slow Slew Rate
(4, 5)
0.75 0.75 ns
tH Hold Time, Fast Slew Rate
(3,5)
Data Before CLK, CLK 0.75 0.65 ns
Hold Time, Slow Slew Rate
(2,5)
0.9 0.8 ns
SWITCHING CHARACTERISTICS OVER RECOMMENDED FREE-AIR OPERATING
RANGE (UNLESS OTHERWISE NOTED)
PC1600 - PC2700 PC3200
Symbol Parameter Min. Max. Min. Max. Unit
fMAX 200 220 MH z
tPDM CLK and CLK to Q 1.1 2.6 1.1 2.4 ns
tPDMSS CLK and CLK to Q (simultaneous switching) 2.9 2.68 ns
t
PHL RESET to Q 5 5 ns
NOTES:
1. Data inputs must be low a minimum time of tACT max., after RESET is taken HIGH.
2. Data and clock inputs must be held at valid levels (not floating) a minimum time of tINACT max., after RESET is taken LOW.
3. For data signal input slew rate is 1V/ns.
4. For data signal input slew rate is 0.5V/ns and <1V/ns.
5. CLK, CLK signal input slew rates are 1V/ns.
6
COMMERCIAL TEMPERATURE RANGE
IDT74SSTVF16859
13-BIT TO 26-BIT REGISTERED BUFFER WITH SSTL I/O
TEST CIRCUITS AND WAVEFORMS
FOR PC1600 - PC2700, V
DD = 2.5V ± 0.2V
FOR PC3200, VDD = 2.6V ± 0.1V
Voltage Waveforms - Pulse Duration
NOTES:
1. CL includes probe and jig capacitance.
2. IDD tested with clock and data inputs held at VDD or GND, and IO = 0mA.
3. All input pulses are supplied by generators having the following characteristics: PRR 10MHz, ZO = 50Ω, input slew rate = 1 V/ns ±20% (unless otherwise specified).
4. The outputs are measured one at a time with one transition per measurement.
5. VTT = VREF = VDDQ/2
6. VIH = VREF + 310mV (AC voltage levels) for differential inputs. VIH = VDD for LVCMOS input.
7. VIL = VREF - 310mV (AC voltage levels) for differential inputs. VIL = GND for LVCMOS input.
8. tPDM is tPD with one output switching. tPDMSS is tPD with all outputs switching.
Load Circuit
Voltage Waveforms - Setup and Hold Times
Voltage Waveforms - Propagation Delay Times
Voltage Waveforms - Propagation Delay Times
Voltage and Current Waveforms
Inputs Active and Inactive Times
Timing
Input
V
ICR
VI(PP)
tPLH tPH L
Output
V
OH
VOL
VICR
VTT VTT
VOH
VOL
VIH
VIL
tPHL
VDD/2
V
TT
LVCMOS
RESET
Input
Output
VREF
VIH
VIL
VRE F
Input
tW
VREF
VIH
VIL
VREF
Input
VICR VI(PP)
tSU tH
Timing
Input
From output
under test
Test Point
LVCMOS
RESET
Input
V
DD/2
V
DD
tINACT tACT
IDD
VDD/2
90%
0V
(see note 2)
10%
VTT
CL =30pF
(see note 1)
RL =50Ω

74SSTVF16859NLG

Mfr. #:
Manufacturer:
Description:
Registers 13TO26BIT REG BUFFER SSTL
Lifecycle:
New from this manufacturer.
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