LTC3200/LTC3200-5
10
PACKAGE DESCRIPTIO
U
MS8 Package
8-Lead Plastic MSOP
(LTC DWG # 05-08-1660)
OPERATIO
U
The power dissipated in the LTC3200/LTC3200-5 should
always fall under the line shown for a given ambient
temperature. The power dissipated in the LTC3200/
LTC3200-5 is given by the expression:
P
D
≡ (2V
IN
– V
OUT
)I
OUT
This derating curve assumes a maximum thermal
resistance, θ
JA
, of 175°C/W for both the 6 pin ThinSOT
LTC3200-5 and the 8 pin MSOP adjustable LTC3200
which can be achieved from a printed circuit board layout
with a solid ground plane and a good connection to the
ground pins of the LTC3200/LTC3200-5. Operation out-
side of this curve will cause the junction temperature to
exceed 160°C which may trigger the thermal shutdown
circuitry.
MSOP (MS8) 1100
* DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
** DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
0.021
±
0.006
(0.53
±
0.015)
0° – 6° TYP
SEATING
PLANE
0.007
(0.18)
0.043
(1.10)
MAX
0.009 – 0.015
(0.22 – 0.38)
0.005
±
0.002
(0.13
±
0.05)
0.034
(0.86)
REF
0.0256
(0.65)
BSC
12
3
4
0.193
±
0.006
(4.90
±
0.15)
8
7
6
5
0.118
±
0.004*
(3.00
±
0.102)
0.118
±
0.004**
(3.00
±
0.102)
