XC18V00 Series In-System-Programmable Configuration PROMs
DS026 (v6.0) August 5, 2015 www.xilinx.com
Product Specification 22
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— PRODUCT OBSOLETE / UNDER OBSOLESCENCE —
Marking Information
Package Type
VQ44 = 44-pin Plastic Quad Flat Package
VQG44 = 44-pin Plastic Quad Flat Package, Pb-Free
PC44 = 44-pin Plastic Leaded Chip Carrier
(1)
PCG44 = 44-pin Plastic Leaded Chip Carrier, Pb-Free
(1)
Notes:
1. XC18V02 and XC18V04 only.
20-pin Package
(1)
Due to the small size of the serial PROM packages, the complete ordering part number cannot be marked on the
package. The package code is simplified. Device marking is as follows:
44-pin Package
XC18V04 VQ44
Operating Range
[no mark] = Industrial (T
A
= –40°C to +85°C)
Device Number
XC18V04
XC18V02
XC18V01
XC18V512
XC18V01 S
Package Type
S = 20-pin Small-Outline Package
(2)
SG = 20-pin Small-Outline Package, Pb-free
(2)
J = 20-pin Plastic Leaded Chip Carrier
(2)
JG = 20-pin Plastic Leaded Chip Carrier, Pb-free
(2)
Notes:
1. Refer to XC18V00 PROM product change notices (PCNs) for legacy part markings.
2. XC18V01 and XC18V512 only.
Device Number
18V01
18V512
Operating Range
[no mark] = Industrial (T
A
= –40°C to +85°C)
XC18V00 Series In-System-Programmable Configuration PROMs
DS026 (v6.0) August 5, 2015 www.xilinx.com
Product Specification 23
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Revision History
The following table shows the revision history for this document.
Date Version Revision
02/09/1999 1.0 First publication of this early access specification
08/23/1999 1.1 Edited text, changed marking, added CF
and parallel load
09/01/1999 1.2 Corrected JTAG order, Security and Endurance data.
09/16/1999 1.3 Corrected SelectMAP diagram, control inputs, reset polarity. Added JTAG and CF
description,
256 Kbit and 128 Kbit devices.
01/20/2000 2.0 Added Q44 Package, changed XC18xx to XC18Vxx
02/18/2000 2.1 Updated JTAG configuration, AC and DC characteristics
04/04/2000 2.2 Removed stand alone resistor on INIT pin in Figure 5. Added Virtex-E and EM parts to FPGA table.
06/29/2000 2.3 Removed XC18V128 and updated format. Added AC characteristics for XC18V01, XC18V512, and
XC18V256 densities.
11/13/2000 2.4 Features: changed 264 MHz to 264 Mb/s at 33 MHz; AC Spec.: T
SCE
units to ns, T
HCE
CE High time
units to μs. Removed Standby mode statement: “The lower power standby modes available on
some XC18V00 devices are set by the user in the programming software”. Changed 10,000 cycles
endurance to 20,000 cycles.
01/15/2001 2.5 Updated Figures 5 and 6, added 4.7 resistors. Identification registers: changes ISP PROM product
ID from 06h to 26h.
04/04/2001 2.6 Updated Figure 8, Virtex SelectMAP mode; added XC2V products to Compatible PROM table;
changed Endurance from 10,000 cycles, 10 years to 20,000, 20 years;
04/30/2001 2.7 Updated Figure 8: removed Virtex-E in Note 2, fixed SelectMAP mode connections. Under "AC
Characteristics Over Operating Conditions for XC18V04 and XC18V02", changed T
SCE
from 25 ms
to 25 ns.
06/11/2001 2.8 "AC Characteristics Over Operating Conditions for XC18V01 and XC18V512". Changed Min values
for T
SCE
from 20 ms to 20 ns and for T
HCE
from 2 ms to 2 μs.
09/28/2001 2.9 Changed the Boundary-Scan order for the CEO pin in Ta ble 1 , updated the configuration bits values
in the table under "Xilinx FPGAs and Compatible PROMs", and added information to the
"Recommended Operating Conditions" table.
11/12/2001 3.0 Updated for Spartan-IIE FPGA family.
12/06/2001 3.1 Changed Figure 5(c).
02/27/2002 3.2 Updated Ta bl e 2 and Figure 8 for the Virtex-II Pro family of devices.
03/15/2002 3.3 Updated Xilinx software and modified Figure 8 and Figure 5.
03/27/2002 3.4 Made changes to pages 1-3, 5, 7-11, 13, 14, and 18. Added new Figure 9 and Figure 9.
06/14/2002 3.5 Made additions and changes to Ta bl e 2 .
07/24/2002 3.6 Changed last bullet under Connecting Configuration PROMs, page 9.
09/06/2002 3.7 Multiple minor changes throughout, plus the addition of Pinout Diagrams, page 4 and the deletion
of Figure 9.
10/31/2002 3.8 Made minor change on Figure 5 (b) and changed orientation of SO20 diagram on page 5.
11/18/2002 3.9 Added XC2S400E and XC2S600E to Ta bl e 2 .
04/17/2003 3.10 Changes to "Description", "External Programming", and Tab le 2 .
XC18V00 Series In-System-Programmable Configuration PROMs
DS026 (v6.0) August 5, 2015 www.xilinx.com
Product Specification 24
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— PRODUCT OBSOLETE / UNDER OBSOLESCENCE —
06/11/2003 4.0 Major revision.
Added alternate IDCODES to Ta ble 5.
Discontinued XC18V256 density.
Eliminated industrial ordering combinations.
Extended commercial temperature range.
Added MultiPRO Desktop Tool support.
Changed T
HOE
and T
HCE
to 250 ns in the tables on <RD Red>page 17 and <RD Red>page 18.
Made change in capacitance values "DC Characteristics Over Operating Conditions".
Added Note (3) to Tabl e 1.
Other minor edits.
12/15/2003 4.1 Added specification (4.7 kΩ) for recommended pull-up resistor on OE/RESET
pin to section Reset
and Power-On Reset Activation, page 14.
Added paragraph to section Standby Mode, page 14, concerning use of a pull-up resistor and/or
buffer on the DONE pin.
04/05/2004 5.0 Major revision.
Figure 2: Revised configuration bitstream lengths for most Virtex-II FPGAs.
Replaced previous schematics in Figures 5, 6, 7(a), 7(b), and 7(c) with new Figure 5, Figure 6,
Figure 7, and Figure 8.
Replaced previous Figure 8 with new Figure 9.
Replaced previous power-on text section with new Reset and Power-On Reset Activation,
page 14.
Added specification table Supply Voltage Requirements for Power-On Reset and Power-Down,
page 15.
Added Footnote (5) to:
Specification table AC Characteristics Over Operating Conditions When Cascading for
XC18V04 and XC18V02, page 19.
Specification table AC Characteristics Over Operating Conditions When Cascading for
XC18V01 and XC18V512, page 20.
Numerous copyedits and wording changes/clarifications throughout.
07/20/2004 5.0.1 Tabl e 2: Removed reference to XC2VP125 FPGA.
03/06/2006 5.1 Added Pb-free packages to Features, page 1, Pinout Diagrams, page 4,"Ordering Information",
Valid Ordering Combinations, page 21and Marking Information, page 22.
Removed maximum soldering temperature (T
SOL
) from Absolute Maximum Ratings
(1,2)
,
page 15. Refer to Xilinx Device Package User Guide for package soldering guidelines.
Added information to Tabl e 5 regarding variable JTAG IDCODE revision field.
01/11/2008 5.2 Updated document template.
Updated URLs.
Tied RDWR_B and CS_B to GND to ensure valid logic-level Low in FPGA SelectMAP mode in
Figure 6, page 11 and Figure 8, page 13.
Updated "Marking Information," page 22 for 20-pin packaging.
08/05/2015 6.0 This product is obsolete/discontinued per XCN15008
. Updated Notice of Disclaimer.

AT25DQ321-SH-B

Mfr. #:
Manufacturer:
Adesto Technologies
Description:
NOR Flash 32M 2.7-3.6V, 100Mhz Serial Flash
Lifecycle:
New from this manufacturer.
Delivery:
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