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AA3529SES/L

P1-P3P4-P6
SPEC NO: DSAH3956 REV NO: V.7 DATE: NOV/26/2008 PAGE: 1 OF 6
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: Y.F.Lu ERP: 1201002739
Description
The Red-orange device is made with TS AlInGaP light
emitting diode.
Part Number: AA3529SES/L Hyper Orange
PRELIMINARY SPEC
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25(0.01") unless otherwise noted.
3. Specifications are subject to change without notice.
4. The device has a single mounting surface. The device must be mounted according to the specifications.
3.5x2.8 mm SMD CHIP LED LAMP
Features
zSingle color.
zSuitable for all SMT assembly and solder
process.
zAvailable on tape and reel.
zIdeal for backlighting.
zWhite SMD package, silicone resin.
zLow thermal resistance.
zPackage: 1500pcs / reel.
zMoisture sensitivity level : level 2a.
zRoHS compliant.
SPEC NO: DSAH3956 REV NO: V.7 DATE: NOV/26/2008 PAGE: 2 OF 6
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: Y.F.Lu ERP: 1201002739
Handling Precautions
Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic
significantly reduces thermal stress, it is more susceptible to damage by external mechanical force.
As a result, special handling precautions need to be observed during assembly using silicone encapsulated
LED products. Failure to comply might leads to damage and premature failure of the LED.
1. Handle the component along the side surfaces by using forceps or appropriate tools.
2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.
4. The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner diameter
of the nozzle should be as large as possible.
5. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.
6. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup
and avoid damage during production.
3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or
damage the internal circuitry.
SPEC NO: DSAH3956 REV NO: V.7 DATE: NOV/26/2008 PAGE: 3 OF 6
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: Y.F.Lu ERP: 1201002739
Selection Guide
Part No.
Dice Lens Type
Iv (mcd) [2]
@ 150mA
V
iewing
Angle [1]
Min. Typ. Min. Typ.
2θ1/2
AA3529SES/L Hyper Orange (AlInGaP) WATER CLEAR 3800 6000 2500 4000
120°
Φv (mlm) [2]
@ 150mA
Notes:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
2. Luminous intensity / luminous flux: +/-15%.
Absolute Maximum Ratings at TA=25°C
Parameter Symbol Value Unit
Power Dissipation Pt 615 mW
Junction Temperature [1] TJ 110 °C
Operating Temperature Top -40 To +85 °C
Storage Temperature Tstg -40 To +85 °C
DC Forward Current [1] IF 150 mA
Peak Forward Current [2] IFM 350 mA
Thermal Resistance [1]
(Junction/ambient)
Rth j-a 200 °C/W
Thermal Resistance [1]
(Junction/solder point)
Rth j-S 80 °C/W
Notes:
1.Results from mounting on PC board FR4(pad size≥70mm
2
), mounted on pc board-metal core PCB is recommend
for lowest thermal Resistance.
2.1/10 Duty Cycle, 0.1ms Pulse Width.
Electrical / Optical Characteristics at TA=25°C
Symbol Parameter Device Typ. Max. Test Conditions Units
λpeak
Peak Wavelength Hyper Orange 626 nm IF=150mA
λD [1]
Dominant Wavelength Hyper Orange 618 nm IF=150mA
Δλ1/2
Spectral Line Half-width Hyper Orange 20 nm IF=150mA
C Capacitance Hyper Orange 25 pF VF=0V;f=1MHz
VF [2] Forward Voltage Hyper Orange 3.6 4.1 V IF=150mA
IR Reverse Current Hyper Orange 10 uA VR = 5V
Notes:
1.Wavelength: +/-1nm.
2. Forward Voltage: +/-0.1V.
P1-P3P4-P6

AA3529SES/L

Mfr. #:
Buy AA3529SES/L
Manufacturer:
Kingbright
Description:
High Power LEDs - Single Color Red-Orange Wtr Clr 618nm 4cd
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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