905-29-1-12-2-B-0 Datasheet 905-29-1-33-2-B-0, 905-29-1-18-2-B-0, 905-29-1-15-2-B-0 | P1-P3

Wakefield-Vette’s 900 Series Heat Sinks for Chipset can match up

to devices from

Intel, Broadcom, Xilinx, TI, Motorola, ATI, AMD, Nvidia, Vishay, Pow

erex, Infineon, Microsemi, and many more.

These heat sinks are designed for air flow applications in the

Telecom, Data Center, Networking, Cloud Computing, and many

more Industries.

Material: AL 6063

Finish: Black Anodize

ELLIPTICAL FIN HEAT SINK

905 Series

PART #

HEIGHT

(mm)

CHIP SIZE

(mm)

NATURAL

CONVECTION

FORCED CONVECTION (C/W)

200 LFM

400 LFM

600 LFM

905-29-1-12-2-B-0

12.47 C/W

4.09 C/W

2.74 C/W

2.25 C/W

905-29-1-15-2-B-0

11.86 C/W

3.81 C/W

2.52 C/W

2.02 C/W

905-29-1-18-2-B-0

11.25 C/W

3.56 C/W

2.31 C/W

1.84 C/W

905-29-1-21-2-B-0

10.63 C/W

3.3 C/W

2.12 C/W

1.65 C/W

905-29-1-23-2-B-0

10.23 C/W

3.06 C/W

1.91 C/W

1.49 C/W

905-29-2-28-2-B-0

9.24 C/W

2.72 C/W

1.69 C/W

1.33 C/W

905-29-1-33-2-B-0

8.24 C/W

2.47 C/W

1.49 C/W

1.18 C/W

4.5

905-29-1-12-2-B-0

THERMAL PERFORMANCE:

T h e r m a l C o o l i n g S o l u t i o n s f r o m

S m a r t

t o

F i n i s h

www.wakefield-vette.com

1.5

2.5

3.5

200 LFM

400 LFM

600 LFM

C/ Watt

Forced Convection

905-29-1-12-2-B-0

905-29-1-15-2-B-0

905-29-1-18-2-B-0

905-29-1-21-2-B-0

905-29-1-23-2-B-0

905-29-2-28-2-B-0

905-29-1-33-2-B-0

Series

Chip Size

Construction

Height

Chip Height

Finish

Interface

905-

19-

12-

B-

1= Eliptical Fin

12 = 11.6

1 = .9-2.1

B = BLK

ANO

0 = None

15 = 14.6

2 = 2.2-3.4

1 = T725

18 = 17.6

21 = 20.6

23 = 22.6

28 = 27.6

33 = 32.6

37.5

ELLIPTICAL FIN HEAT SINK

905 Series

ASSEMBLY INSTRUCTION:

Wakefield-Vette’s heat sink assembles onto chip set using the space that is between the PCB and

the substrate of the solder balls. The solder balls provide a minimal gap of .5mm to .7mm.

Attachment feature is below a .4mm thickness. The clipping system will not interfere or damage

chip. Contact area is the edge of chip.

T h e r m a l C o o l i n g S o l u t i o n s f r o m

S m a r t

t o

F i n i s h

www.wakefield-vette.com

Random Vibration Test

Frequency ：5 Hz to 500 Hz

Acceleration ：3.13 grms

P.S.D ：0.01 g2/HZ (5 Hz)

0.02 g2/HZ (20 Hz to 500 Hz)

Test Axis ：X, Y, Z axis

Test Time ：10 mins (Each axis)

Total Test Time ：30 mins

SHOCK TEST SPECIFICATION：

Wave Form ：Half sine wave

Acceleration ：50 g

Duration Time ：11 ms

No. of Shock ：Each axis 3 times

Shock Direction ：±X, ±Y, ±Z axis

Reliability & Communication

Testing Instruments

Step 1: Hook the

clip under one

side of the BGA

chip set.

Step 2: Rotate

assembly down

until opposite

side clip engages

substrate edge of

BGA chip set.

Step 3: Make sure

the sop rods are

clearing from edges

of BGA chip set.

Step 4: Press firmly

down to make sure

clips fully engage

edges of chip set.

Heat Sink should not

move around easily.

P1-P3

905-29-1-12-2-B-0

Mfr. #:

Buy 905-29-1-12-2-B-0

Manufacturer:

Wakefield-Vette

Description:

CHIPSET HEAT SINKS - 29X29MM ELIPTICAL FIN HEAT SINK WITH CLIP

Lifecycle:

New from this manufacturer.

Delivery:

DHL FedEx Ups TNT EMS

Payment:

T/T Paypal Visa MoneyGram Western Union

905-29-1-12-2-B-0

905-29-1-12-2-B-0

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