DTO25
www.vishay.com
Vishay Sfernice
Revision: 29-Mar-17
1
Document Number: 51054
For technical questions, contact: sferfixedresistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Surface Mounted Power Resistor Thick Film Technology
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FEATURES
• AEC-Q200 qualified
• 25 W at 25 °C case temperature
• Surface mounted resistor - TO-252 (DPAK) style
package
• Wide resistance range: 0.016 to 700 k
• Non inductive
• Resistor isolated from metal tab
• Solder reflow secure at 270 °C / 10 s, MSL = 1
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Notes
• For the assembly, we recommend the lead (Pb)-free thermal profile as per J-STD-020C.
• Power dissipation is 3.2 W at an ambient temperature of 25 °C when mounted on a double sided copper board using FR4 HTG, 70 μm of
copper, 39 mm x 30 mm x 1.6 mm, with thermal vias.
• For other information about dissipation, see the Application Note 52027: “Thermal Management on SMD Thick Film Resistors (D2TO20,
D2TO35, DTO25)”.
DIMENSIONS in millimeters
STANDARD ELECTRICAL SPECIFICATIONS
MODEL SIZE
RESISTANCE
RANGE
RATED POWER
P
25 °C
W
LIMITING ELEMENT
VOLTAGE U
L
V
TOLERANCE
± %
TEMPERATURE
COEFFICIENT
± ppm/°C
CRITICAL
RESISTANCE
DTO25 TO-252 (DPAK) 0.016 to 700K 25 200 1, 2, 5, 10 150 1.6K
7.87
2.54
1.65 1.65
8.513.81
1.78
2.54
Footprint recommendation for
solderable contact area:
Tolerance unspecified: ± 0.3
8.2
7.3
1
0.8 ± 0.1
1.4 +0.2 /-0
0.8 ± 0.1
2.8
1.8
1.6 ± 0.1
0.6 ± 0.1
1.2
6.35
10°
5.08
6.82
12.4
4.1
MECHANICAL SPECIFICATIONS
Mechanical Protection Molded
Resistive Element Thick film
Substrate Alumina
Connections Tinned copper, Ni under layer
Weight 2 g max.
ENVIRONMENTAL SPECIFICATIONS
Temperature Range -55 °C to +150 °C
Climatic Category 55 / 150 / 56
Flammability
IEC 60695-11-5
2 applications 30 s
separated by 60 s
ELECTRICAL SPECIFICATIONS
Tolerances
From 0.016 to 0.047 :
± 5 % and ± 10 %
> 0.047 to 0.1 :
± 2 % to ± 10 %
0.11 : ± 1 % to ± 10 %
Power Rating and Thermal
Resistance
25 W at +25 °C case
temperature R
TH (j - c)
: 5 °C/W
Temperature Coefficient
See Special Feature table
± 150 ppm/°C
Dielectric Strength
1500 V
RMS
- 1 min - 15 mA max.
(between terminals and board)
Insulation Resistance 10
4
M
Inductance 0.1 μH