OMO ElectronicOMO Electronic
Expand menu
Hello, Sign inMy Account
0 Cart

352262KFT

P1-P3P4-P6
DTO25
www.vishay.com
Vishay Sfernice
Revision: 29-Mar-17
1
Document Number: 51054
For technical questions, contact: sferfixedresistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Surface Mounted Power Resistor Thick Film Technology
DESIGN SUPPORT TOOLS click logo to get started
FEATURES
• AEC-Q200 qualified
• 25 W at 25 °C case temperature
• Surface mounted resistor - TO-252 (DPAK) style
package
• Wide resistance range: 0.016 to 700 k
• Non inductive
• Resistor isolated from metal tab
• Solder reflow secure at 270 °C / 10 s, MSL = 1
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Notes
• For the assembly, we recommend the lead (Pb)-free thermal profile as per J-STD-020C.
• Power dissipation is 3.2 W at an ambient temperature of 25 °C when mounted on a double sided copper board using FR4 HTG, 70 μm of
copper, 39 mm x 30 mm x 1.6 mm, with thermal vias.
• For other information about dissipation, see the Application Note 52027: “Thermal Management on SMD Thick Film Resistors (D2TO20,
D2TO35, DTO25)”.
Available
Models
DIMENSIONS in millimeters
STANDARD ELECTRICAL SPECIFICATIONS
MODEL SIZE
RESISTANCE
RANGE
RATED POWER
P
25 °C
W
LIMITING ELEMENT
VOLTAGE U
L
V
TOLERANCE
± %
TEMPERATURE
COEFFICIENT
± ppm/°C
CRITICAL
RESISTANCE
DTO25 TO-252 (DPAK) 0.016 to 700K 25 200 1, 2, 5, 10 150 1.6K
7.87
2.54
1.65 1.65
8.513.81
1.78
2.54
Footprint recommendation for
solderable contact area:
Tolerance unspecified: ± 0.3
8.2
7.3
1
0.8 ± 0.1
1.4 +0.2 /-0
0.8 ± 0.1
2.8
1.8
1.6 ± 0.1
0.6 ± 0.1
1.2
6.35
10°
5.08
6.82
12.4
4.1
MECHANICAL SPECIFICATIONS
Mechanical Protection Molded
Resistive Element Thick film
Substrate Alumina
Connections Tinned copper, Ni under layer
Weight 2 g max.
ENVIRONMENTAL SPECIFICATIONS
Temperature Range -55 °C to +150 °C
Climatic Category 55 / 150 / 56
Flammability
IEC 60695-11-5
2 applications 30 s
separated by 60 s
ELECTRICAL SPECIFICATIONS
Tolerances
From 0.016 to 0.047 :
± 5 % and ± 10 %
> 0.047 to 0.1 :
± 2 % to ± 10 %
0.11 : ± 1 % to ± 10 %
Power Rating and Thermal
Resistance
25 W at +25 °C case
temperature R
TH (j - c)
: 5 °C/W
Temperature Coefficient
See Special Feature table
± 150 ppm/°C
Dielectric Strength
1500 V
RMS
- 1 min - 15 mA max.
(between terminals and board)
Insulation Resistance 10
4
M
Inductance 0.1 μH
DTO25
www.vishay.com
Vishay Sfernice
Revision: 29-Mar-17
2
Document Number: 51054
For technical questions, contact: sferfixedresistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
DIMENSIONS
Standard Package TO-252 style (DPAK)
SPECIAL FEATURES
Resistance Values 0.016 0.1 0.5
Requirement Temperature Coefficient (TCR)
(-55 °C +150 °C) IEC 60115-1
± 900 ppm/°C ± 350 ppm/°C ± 150 ppm/°C
PERFORMANCE
TESTS CONDITIONS REQUIREMENTS
Momentary Overload
IEC 60115-1 §4.13
1.6 Pr 5 s
US < 1.5 UL
± (0.25 % + 0.005 )
Load Life
IEC 60115-1
1000 h, 90/30 Pr at +25 °C
± (1 % + 0.005 )
High Temperature Exposure
AEC-Q200 REV D conditions:
MIL-STD-202 method 108
1000 h, +175 °C, unpowered
± (1 % + 0.005 )
Temperature Cycling
AEC-Q200 REV D conditions:
pre-conditioning 3 reflows according
JESTD020D
JESD22 method JA-104
1000 cycles, (-55 °C to +125 °C)
dwell time 15 min
± (0.5 % + 0.005 )
Biased Humidity
AEC-Q200 REV D conditions:
MIL-STD-202 method 103
1000 h, 85°C, 85 % RH
± (0.5 % + 0.005 )
Operational Life
AEC-Q200 REV D conditions:
pre-conditioning 3 reflows according
JESTD020D
MIL-STD-202 method 108
1000 h, 90/30, powered, +125 °C
± (1 % + 0.005 )
ESD Human Body Model
AEC-Q200 REV D conditions:
AEC-Q200-002
25 kV
AD
± (0.5 % + 0.005 )
Vibration
AEC-Q200 REV D conditions:
MIL-STD-202 method 204
20 g’s for 20 min, 12 cycles
test from 10 Hz to 2000 Hz
± (0.5 % + 0.005 )
Mechanical Shock
AEC-Q200 REV D conditions:
MIL-STD-202 method 213
100 g’s, 6 ms, 3.75 m/s
3 shocks/direction
± (0.5 % + 0.005 )
Board Flex
AEC-Q200 REV D conditions:
AEC-Q200-005
bending 2 mm, 60 s
± (0.25 % + 0.01 )
Terminal Strength
AEC-Q200 REV D conditions:
AEC-Q200-006
1.8 kgf, 60 s
± (0.25 % + 0.01 )
ASSEMBLY SPECIFICATIONS
For the assembly on board, we recommend the lead (Pb)-free thermal profile as per J-STD-020C
TESTS CONDITIONS REQUIREMENTS
Resistance to Soldering Heat
AEC-Q200 REV D
MIL-STD-202 method 210
Solder Bath method: 270 °C / 10 s
± (0.5 % + 0.005 )
Moisture Sensitivity Level (MSL)
IPC / JEDEC
®
J-STD-020C
85 °C / 85 % RH / 168 h
Level: 1
+ pass requirements of TCR
Overload and Dielectic Strength after MSL
DTO25
www.vishay.com
Vishay Sfernice
Revision: 29-Mar-17
3
Document Number: 51054
For technical questions, contact: sferfixedresistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
POWER RATING
The temperature of the case should be maintained within the limits specified.
CHOICE OF THE BOARD
The user must choose the board according to the working conditions of the component (power, room temperature). Maximum
working temperature must not exceed 150 °C. The dissipated power is simply calculated by the following ratio:
P: Expressed in W
T: Difference between maximum working temperature and room temperature
R
TH (j - c)
: Thermal resistance value measured between resistive layer and outer side of the resistor. It is the thermal resistance
of the component: 5 °C/W.
R
TH (c - h)
: Thermal resistance value measured between outer side of the resistor and upper side of the board. This is the thermal
resistance of the solder layer.
R
TH (h - a)
: Thermal resistance of the board.
Example:
R
TH (c - h)
+ R
TH (h - a)
for DTO25 power rating 3 W at ambient temperature +25 °C.
Thermal resistance R
TH (j - c)
: 5 °C/W
Considering equation
(1)
we have:
T = 150 °C - 25 °C = 125 °C
R
TH (j - c)
+ R
TH (c - h)
+ R
TH (h - a)
= T/P = 125/3 = 41.7 °C/W
R
TH (c - h)
+ R
TH (h - a)
= 41.7 °C/W - 5 °C/W = 36.7 °C/W
ACCIDENTAL OVERLOAD
In any case the applied voltage must be lower than the maximum overload voltage of U
s
= 300 V. The values indicated on the
graph below are applicable to resistors onto a board.
ENERGY CURVE at 25 °C POWER CURVE at 25 °C
50
25
0
100
CASE TEMPERATURE IN °C
% OF RATED DISSIPATION
80
60
40
20
0
100 150 200
P
T
R
TH (j - c)
R
TH (c - h)
R
TH (h - a)
++
-------------------------------------------------------------------------------------------
1
=
0.001
0.01
0.1
1
10
100
ENERGY IN JOULES
OVERLOAD DURATION IN s
10
-7
10
-6
10
-5
10
-4
10
-3
10
-2
10
-1
POWER IN W
OVERLOAD DURATION IN s
10
-7
10
-6
10
-5
10
-4
10
-3
10
-2
10
-1
10
1000
10 000
100 000
100
P1-P3P4-P6

352262KFT

Mfr. #:
Buy 352262KFT
Manufacturer:
Description:
Thick Film Resistors - SMD 3522 62K 1% 3W
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet