 9
Version 1.4 SFH 4232
Max. Permissible Forward Current
I
F
= f(T
S
), R
thJS
= 9 K/W
Forward Current
$page 12
I
F
= f(V
F
), single pulse, t
p
= 100 µs, T
A
= 25°C
Permissible Pulse Handling Capability
I
F
= f(t
p
), T
S
= 85 °C, duty cycle D = parameter
0
0
˚C
T
I
F
A
OHF04369
S
20 40 60 80 100 130
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.1
OHF03847
V
F
0
10
10
1
10
-1
10
-2
F
I
A
0 V0.5 1 1.5 2 2.5
0
-5
F
I
A
t
p
s
OHF04177
-4
10
-3
10
-2
10
-1
10
0
10
1
10
2
1010
P
t
=
D
T
T
t
P
I
F
0.01
0.33
0.5
0.2
0.1
0.02
D
0.005
=
0.05
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.5
1
Version 1.4 SFH 4232

Radiation Characteristics
$page 12
I
rel
= f(ϕ), T
A
= 25°C
Package Outline
Dimensions in mm (inch).
Cathode mark on the bottom side
0
0.2
0.4
1.0
0.8
0.6
ϕ
1.0 0.8 0.6 0.4
10˚20˚40˚ 30˚
OHL01660
50˚
60˚
70˚
80˚
90˚
100˚
20˚ 40˚ 60˚ 80˚ 100˚ 120˚
 8
Version 1.4 SFH 4232
Note:
Corrosion robustness better than EN 60068-2-60 (method 4): with enhanced corrosion test: 40°C / 90%rh
/ 15ppm H2S / 336h
Type:
SFH 4232
Package
Platinum Dragon
Approximate Weight:
0.2 g
Recommended Solder Pad
Dimensions in mm (inch).
Attention
Anode and Heatsink are electrically connected
Solder resist
Freies Kupfer
Bare Copper
Lötpasten Schablone
Solder paste stencil
Lötstopplack
OHAY0681
0.3 (0.012)
Kupfer
Copper
1.6 (0.063)
11.6 (0.457)
12.0 (0.472)
2.3 (0.091)
2.3 (0.091)
10 (0.394)
1.6 (0.063)
11.6 (0.457)
3 Lötstellen
3 solder points
Thermal enhanced PCB
Thermisch optimiertes PCB
ø4.0 (0.157)
Heatsink attach
ø4.0 (0.157)
ø2.5 (0.098)

SFH 4232-Z

Mfr. #:
Manufacturer:
OSRAM Opto Semiconductors
Description:
Infrared Emitters - High Power Infrared 850nm 530mW @ 1000mA
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet