PGB2010402KRHF

www.littelfuse.com
©2008 Littelfuse
PGB2 Series
Specifications are subject to change without notice.
1
Revised: December 8, 2008
PulseGuard
®
Suppressors
Surface Mount Polymeric ESD Suppressors
PulseGuard ESD Suppressors help protect sensitive
electronic equipment against electrostatic discharge (ESD).
They use polymer composite materials to suppress fast-
rising ESD transients (as specified in IEC 61000-4-2), while
adding virtually no capacitance to the circuit.
They supplement the on-chip protection of integrated
circuitry and are best suited for low-voltage, high-speed
applications where low capacitance is important to ensure
minimal interference of data signal integrity.
The new and ultra-small surface mount PGB2 0402 series
offers a RoHS Compliant, Halogen Free, and 100% Lead
Free circuit protection alternative.
PGB2 Series Halogen Free / Lead-Free
Description
Features
Applications
t)%57)BSEXBSF
t-BQUPQ%FTLUPQ
Computers
t/FUXPSL)BSEXBSF
t$PNQVUFS1FSJQIFSBMT
t%JHJUBM$BNFSBT
t&YUFSOBM4UPSBHF
t4FU5PQ#PYFT
t3P)4DPNQMJBOU
t-FBEGSFF
t)BMPHFOGSFF
t6MUSBMPXDBQBDJUBODF
t-PXMFBLBHFDVSSFOU
t'BTUSFTQPOTFUJNF
t0OFMJOFPGQSUFDUJPO
t#JEJSFDUJPOBM
t8JUITUBOETNVMUJQMF
&4%TUSJLFT
t$PNQBUJCMFXJUI
QJDLBOEQMBDFQSPDFTTFT
Equivalent Circuits
2
1
Product Characteristics
Part Number Lines Protected Component Package
PGB2010402KRHF 1 0402
Electrical Characteristics
Specification PGB2010402 Notes
ESD Capability:
IEC 61000-4-2 Direct Discharge
IEC 61000-4-2 Air Discharge
L7
L7
5SJHHFS7PMUBHFUZQJDBM
$MBNQJOH7PMUBHFUZQJDBM
7
7
Measured per IEC 61000-4-2
L7%JSFDU%JTDIBSHF.FUIPE
5SJHHFS7PMUBHFUZQJDBM
$MBNQJOH7PMUBHFUZQJDBM
7
7
.FBTVSFEVTJOH75-1%JSFDU
Discharge Method
3BUFE7PMUBHFNBYJNVN 7%$NBY
Capacitance (typical) 0.07 pF, typical Measured at 250 MHz
Response Time <1nS
Measured per IEC 61000-4-2
L7%JSFDU%JTDIBSHF.FUIPE
-FBLBHF$VSSFOUUZQJDBM <1nA .FBTVSFEBU7%$
&4%1VMTF8JUITUBOE 1000 pulses min
Some shifting in characteristics may
occur when tested over multiple
pulses at a very rapid rate
www.littelfuse.com
©2008 Littelfuse
PGB2 Series
Specifications are subject to change without notice.
2
Revised: December 8, 2008
PulseGuard
®
Suppressors
Surface Mount Polymeric ESD Suppressors
Typical Device Capacitance
Typical ESD Response CurveL7*&$%JSFDU%JTDIBSHF
0
100
200
300
400
500
-25 0 25 50 75 100 125 150 175
Time (ns)
Voltage (V)
Dimensions
1.00 +/- 0.05
(0.039" +/- 0.002")
0.50 +/- 0.05
(0.020" +/- 0.002")
0.20 +/- 0.09
(0.008" +/- 0.004")
0.27 +/- 0.09
(0.011" +/- 0.004")
0.30 +/- 0.08
(0.012" +/- 0.003")
0.23 Nom.
(0.009")
0.559
(0.022")
Recommended for
reflow soldering only
0.381
(0.015")
.584
(0.023")
1.55
(0.061")
Recommended Pad Layout
Part Numbering System
PGB2 01 0402 KR HF
QUANTITY &
PACKAGING CODE:
KR = 10,000 pieces
LINES PROTECTED:
01 = 1 line
DEVICE SIZE CODE:
0402 = 0402 (1005)
LEAD-FREE
HALOGEN-FREE
PULSEGUARD
®
ESD SUPPRESSORS
HALOGEN FREE
Dimensions: mm (inch)
Typical TLP Response Curve 7%JSFDU%JTDIBSHF
Typical Insertion Loss
0
50
100
150
200
-15 0 15 30 45 60 75
Time (ns)
Voltage (V)
-12
-10
-8
-6
-4
-2
0
2
10 100 1000 10000 100000
Frequency (MHz)
Insertion Loss (dB)
0.01
0.1
100 1000 10000
Frequency (MHz)
Capacitance (pF)
www.littelfuse.com
©2008 Littelfuse
PGB2 Series
Specifications are subject to change without notice.
3
Revised: December 8, 2008
PulseGuard
®
Suppressors
Surface Mount Polymeric ESD Suppressors
Environmental Specifications
Operating Temperature -65°C to +125°C
Biased Humity:
Biased Heat:
40°C, 95% RH, 1000 hours
85°C, 85% RH, 1000 hours
Thermal Shock
MIL-STD-202, Method 107G,
-65°C to 125°C, 30 min. cycle,
10 cycles
Vibration MIL-STD-202, Method 201A
Chemical Resistance MIL-STD-202, Method 215
Solder Leach Resistance and
Terminal Adhesion
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Physical Specifications
Materials
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5FSNJOBUJPOT/JDLFM5JO
Device Weight 0.258 mg
Solderability MIL-STD-202, Method 208
Soldering
Parameters
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Design Consideration
Because of the fast rise-time of the ESD transient, proper
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consideration to achieving optimal ESD suppression. The
devices should be placed on the circuit board as close to the
source of the ESD transient as possible. Install PulseGuard
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directly behind the connector so that they are the first board-
level circuit component encountered by the ESD transient.
Soldering Parameters
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (T
s(min)
) 150°C
- Temperature Max (T
s(max)
) 200°C
- Time (min to max) (t
s
) 60 – 180 seconds
Average ramp up rate (Liquidus Temp
(T
L
) to peak
¡$TFDPOENBY
T
S(max)
to T
L
- Ramp-up Rate ¡$TFDPOENBY
Reflow
- Temperature (T
L
) (Liquidus) 217°C
- Temperature (t
L
) 60 – 150 seconds
Peak Temperature (T
P
) 260°C
Time within 5°C of actual peak
Temperature (t
p
)
10 – 30 seconds
Ramp-down Rate ¡$TFDPOENBY
Time 25°C to peak Temperature (T
P
) NJOVUFTNBY
Notes:
- PGB2 Series recommended for reflow soldering only
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- For recommended soldering pad layout dimensions,
please refer to Dimensions section of this data sheet

PGB2010402KRHF

Mfr. #:
Manufacturer:
Littelfuse
Description:
TVS Diodes / ESD Suppressors PULSEGUARD 0402
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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