ADA4304-3/ADA4304-4 Data Sheet
Rev. A | Page 4 of 11
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
Supply Voltage 5.5 V
Power Dissipation See Figure 3
Storage Temperature Range −65°C to +125°C
Operating Temperature Range −40°C to +85°C
Lead Temperature (Soldering, 10 sec) 300°C
Junction Temperature 150°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This
is a stress rating only; functional operation of the product
at these or any other conditions above those indicated in
the operational section of this specification is not implied.
Operation beyond the maximum operating conditions for
extended periods may affect product reliability.
THERMAL RESISTANCE
θ
JA
is specified for the device (including exposed pad)
soldered to a high thermal conductivity 4-layer (2s2p)
circuit board, as described in EIA/JESD 51-7.
Table 3. Thermal Resistance
Package Type θ
JA
Unit
16-Lead LFCSP (Exposed Pad) 98 °C/W
Maximum Power Dissipation
The maximum safe power dissipation in the ADA4304-3/
ADA4304-4 package is limited by the associated rise in
junction temperature (T
J
) on the die. At approximately
150°C, which is the glass transition temperature, the plastic
changes its properties. Even temporarily exceeding this
temperature limit can change the stresses that the package
exerts on the die, permanently shifting the parametric
performance. Exceeding a junction temperature of 150°C
for an extended period can result in changes in the silicon
devices, potentially causing failure.
The power dissipated in the package (P
D
) is essentially equal to
the quiescent power dissipation, that is, the supply voltage (V
S
)
times the quiescent current (I
S
). In Table 1, the maximum
power dissipation of the ADA4304-3/ADA4304-4 can be
calculated as
P
D (MAX)
= 5.25 V × 105 mA = 551 mW
Airflow increases heat dissipation, effectively reducing θ
JA
.
In addition, more metal directly in contact with the package
leads/exposed pad from metal traces, through-holes, ground,
and power planes reduces the θ
JA
.
Figure 3 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the 16-lead LFCSP
(98°C/W) on a JEDEC standard 4-layer board.
0
0 100
AMBIENT TEMPERATURE (°C)
MAXIMUM POWER DISSIPATION (W)
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
10 20 30 40 50 60 70 80 90
07082-003
Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
ESD CAUTION
